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COOL Chips 24 2021 : IEEE Symposium on Low-Power and High-Speed Chips and Systems

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Link: http://www.coolchips.org/
 
When Apr 14, 2021 - Apr 16, 2021
Where Bunkyo-ku, Tokyo, Japan
Submission Deadline Feb 5, 2021
Notification Due Mar 12, 2021
Final Version Due Mar 26, 2021
Categories    computer architecture   microarchitecture    software   VLSI
 

Call For Papers

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IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 24

Takeda Hall, The University of Tokyo, Tokyo, Japan

April 14 - 16, 2021
http://www.coolchips.org

CALL FOR CONTRIBUTIONS
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* Submission site: https://easychair.org/conferences/?conf=coolchips24

* Author Schedule for Technical Papers:
- Feb. 5th, 2021: Paper/Extended Abstract Submission
- Mar. 12th, 2021: Acceptance Notified (by e-mail)
- Mar. 26th, 2021: Final Manuscript Submission

* Author Schedule for Posters:
- Mar. 19th, 2021: Extended Poster Abstract Submission
- Mar. 22th, 2021: Poster Acceptance Notified (by e-mail)

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COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems.
The symposium covers leading-edge technologies in all areas of
microprocessors and their applications.
The COOL Chips 24 is to be held in Tokyo on April 14-16, 2021,
and is targeted at the architecture, design and implementation of chips
with special emphasis on the areas listed below.
All papers are published online via IEEE Xplore.
Especially, selected papers are encouraged to submit to the IEEE Micro
(https://publications.computer.org/micro/) and the special section
in the IEICE Transactions on Electronics
(https://search.ieice.org/bin/index.php?category=C&lang=E).

Contributions are solicited in the following areas:

- *Low Power-High Performance Processors* for AI, IoT, Multimedia,
Digital Consumer Electronics, Mobile, Graphics, Encryption,
Robotics, Automotive, Networking, Medical, Healthcare, and
Biometrics.

- *Novel Architectures and Schemes* for Single Core, Multi/Many-Core,
NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and 3D Integration.

- *Cool Software* including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low
Power Application Techniques.

Proposals should should be organized in a full paper format (6 pages)
or an extended abstract format (up to 3 pages) describing the topic
to be presented. If the proposal is a not-yet-announced product,
and you would like to keep the submission confidential,
please indicate it. We will do our best to maintain confidentiality.
Proposals will be selected by the program committee’s evaluation
of interest to the audience.

Please prepare the proposal using the given guidelines and template
(See: https://www.coolchips.org/2021/call-for-contributions/).

Submission should be made through website:
https://easychair.org/conferences/?conf=coolchips24


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Program Committee:

-Chairs:
Makoto Ikeda (Univ. of Tokyo)
Fumio Arakawa (Nagoya Univ.)

-Vice Chair:
Yasutaka Wada(Meisei Univ.)

-Poster Chair:
Koji Hashimoto (Fukuoka Univ.)

-Special Session Chair:
Takatsugu Ono (Kyushu Univ.)

-Members:
Abderazek Ben-Abdallah (Univ. of Aizu)
Kyong-Rok Cho (Chungbuk National Univ.)
Ryusuke Egawa (Tokyo Denki Univ.)
Masaki Gondo (eSOL)
Shinya Honda (Nanzan Univ.)
Megumi Ito (IBM)
Shintaro Izumi (Kobe Univ.)
Kazushi Kawamura(Waseda Univ.)
Ryohei Kobayashi(Univ. of Tsukuba)
Yuetsu Kodama(Riken)
Masanori Muroyama(Tohoku Institute of Tech.)
Mitaro Namiki(Tokyo Univ.of Agriculture and Tech.)
Sugako Otani (Renesas Electronics)
Ryuichi Sakamoto (Univ. of Tokyo)
Yukihiro Sasagawa (Socionext)
Shunsuke Sasaki (Toshiba Electronic Devices &Storage)
Yuichiro Shibata (Nagasaki Univ.)
Hajime Shimada (Nagoya Univ.)
Kotaro Shimamura (Hitachi)
Salita Sombatsiri (NEC)
Shinya Takamaeda-Yamazaki (Univ. of Tokyo)
Hiroyuki Takizawa (Tohoku Univ.)
Toshiyuki Tsutsumi (Meiji Univ.)

(As of Sept. 14th, 2020, basically in alphabetical order)

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