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CODES + ISSS 2021 : International Conference on Hardware/Software Codesign and System Synthesis


When Oct 10, 2021 - Oct 15, 2021
Where virtual?
Abstract Registration Due Apr 2, 2021
Submission Deadline Apr 9, 2021
Notification Due Jul 5, 2021
Categories    system-level design   embedded and cyber-physical sy

Call For Papers

Call for Papers
International Conference on
Hardware/Software Codesign and System Synthesis
October 10 – October 15, 2021, Virtual Conference

The International Conference on Hardware/Software Codesign and System
Synthesis (CODES+ISSS) is the premier conference in system-level design,
hardware/software co-design, modeling, analysis, and implementation of
modern Embedded Systems, Cyber-Physical Systems, and Internet-of-Things,
from system-level specification and optimization to system synthesis of
multi-processor hardware/software implementations. CODES+ISSS is part of
Embedded Systems Week (ESWEEK), the premier event covering all aspects
of hardware and software design for smart, intelligent and connected
computing systems.

Journal-Track Submissions
- Abstracts: April 2, 2021
- Full Papers: April 9, 2021 (firm)

Work-in-Progress Submissions
- June 4, 2021 (firm)

Notification of Acceptance
- July 5, 2021 (both tracks)

Topics of Interests / Tracks
Track 1) System-level design – Specification, modeling, refinement,
synthesis, and partitioning of embedded systems, hardware-software
co-design, design space exploration, hybrid system modeling and design,
model-based design, design for adaptivity and reconfigurability.

Track 2) Domain and application-specific design – Analysis, design, and
optimization techniques for multimedia, medical, automotive, cyber-
physical, IoT, neural network, and other application domains.

Track 3) Embedded software – Language and library support, compilers,
runtimes, parallelization, software verification, memory management,
virtual machines, operating systems, real-time support, middleware.

Track 4) System architecture – Heterogeneous systems, many-cores,
networked and distributed systems, architecture and micro-architecture
design, exploration and optimization including application-specific
processors and accelerators, reconfigurable and self-adaptive
architectures, storage, memory systems, and networks-on-chip.

Track 5) Simulation, validation and verification – Hardware/software
co-simulation, verification and validation methodologies, formal
verification, hardware accelerated simulation, simulation and
verification languages, models, and benchmarks.

Track 6) Safety, security and reliability – Cross-layer reliability,
resilience and fault tolerance, test methodology, design for security,
reliability, and testability, hardware security, security for embedded,
CPS, and IoT devices.

Track 7) Power-aware systems – Power-aware and energy-aware system
design and methodologies, ranging from low-power embedded and cyber-
physical systems, IoT devices, to energy-efficient large-scale systems
such as cloud datacenters, green computing, and smart grids.

Track 8) Embedded machine learning – Hardware and software design,
implementation, and optimization for machine learning that are
specially designed for resource- and power-constrained embedded, CPS,
and IoT devices.

Track 9) Industrial practices and case studies – Practical impact on
current and/or future industries, application of state-of-the-art
methodologies and tools in various application areas including
wireless, networking, multimedia, automotive, cyber-physical, medical
systems, IoT, etc.

Journal-Integrated Publication Model
CODES+ISSS 2021 has a dual publication model with two tracks: Journal
track papers will be published in the ACM Transactions on Embedded
Computing Systems (TECS) and Work-in-Progress track papers will be
published in the ESWEEK Proceedings. See details at

CODES+ISSS Program Chairs:
Jason Xue, City University of Hong Kong, China
Chengmo Yang, University of Delaware, USA

ESWEEK General Chairs:
Andreas Gerstlauer, University of Texas at Austin, USA
Aviral Shrivastava, Arizona State University, USA

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