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AREdu 2021 : 4th International Workshop on Augmented Reality in Education

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Link: https://aredu.ccjournals.eu/aredu2021/
 
When May 11, 2021 - May 11, 2021
Where Kryvyi Rih, Ukraine
Submission Deadline Mar 21, 2021
Notification Due Apr 22, 2021
Final Version Due May 1, 2021
Categories    virtual reality   augmented reality   mixed reality   gamification
 

Call For Papers

Augmented Reality in Education (AREdu) is a peer-reviewed international Computer Science workshop focusing on research advances, applications of virtual, augmented and mixed reality in education.

Topics of interest:
Virtualization of learning: principles, technologies, tools
Augmented reality gamification
Design and implementation of augmented reality learning environments
Aspects of environmental augmented reality security and ethics
Augmented reality in science education
Augmented reality in professional training and retraining
Augmented reality social and technical issues

Authors are invited to submit full (at least 10 pages) papers through the HotCRP
(https://notso.easyscience.education/aredu/2021/) by March 21, 2021.

Submitted papers will be peer-reviewed by two scholars on the basis of technical quality, relevance, originality, significance, and clarity. If necessary, a third, additional reviewer will be involved. The Program Committee will use these reviews to determine which papers will be accepted for presentation at the workshop. The result of the reviewing will be announced to the submitting authors by email, along with reviewer comments, if any.


Primary requirements

Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this workshop. The review process will be blind peer review.
The submission should be LaTeX-generated PDF paper.

Formatting options

AREdu 2021 uses one-column CEURART style for the proceedings (https://aredu.ccjournals.eu/aredu2021/CEURART.zip). Therefore, for preparing your submission please STRICTLY FOLLOW the "Guidelines to format your document for CEUR-WS" (http://ceur-ws.org/Vol-XXX/sample-1col.pdf) and use sample-1col.tex file from CEURART.zip as template. Your submission should be prepared using TeX and one-column CEURART style. References should use the format, as shown in the "Guidelines to format your document for CEUR-WS".

Paper submission

In case you have never worked with the HotCRP system before, please create HotCRP account it by clicking "Create an account" link at the login form (https://notso.easyscience.education/aredu/2021/newaccount). You will be offered to enter your email and click the 'Create account' button. The instructions for signing in to HotCRP would be sent to your email. After complete registration you should sign in and complete your profile (https://notso.easyscience.education/aredu/2021/profile?redirect=1). Please list potential conflicts of interest - we use this information when assigning reviews. At the "New Submission" link of the AREdu 2021 (https://notso.easyscience.education/aredu/2021/paper/new), please fill in the forms as requested by the instructions.

Related Resources

ICVARS 2024   ACM--2024 the 8th International Conference on Virtual and Augmented Reality Simulations (ICVARS 2024)
CVIV 2024   2024 6th International Conference on Advances in Computer Vision, Image and Virtualization (CVIV 2024) -EI Compendex
ICHVR 2024   2024 2nd International Conference on Haptics and Virtual Reality (ICHVR 2024)
ISMAR 2024   International Symposium on Mixed and Augmented Reality - Journal Track
ICVR 2024   IEEE--2024 the 10th International Conference on Virtual Reality (ICVR 2024)
AH 2024   14th Augmented Human International Conference
MoMM 2024   The 22nd International Conference on Advances in Mobile Computing & Multimedia Intelligence
ISVC 2024   19th International Symposium on Visual Computing
Springer AIVR 2024   Springer--2024 8th International Conference on Artificial Intelligence and Virtual Reality (AIVR 2024)
VRIP 2024   ACM--2024 6th International Conference on Virtual Reality and Image Processing (VRIP 2024)