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ICMESM--Ei Compendex and Scopus 2021 : 2021 6th International Conference on Material Engineering and Smart Materials (ICMESM 2021)--SCOPUS, Ei Compendex

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Link: http://www.icmesm.org/
 
When Jul 13, 2021 - Jul 15, 2021
Where London, United Kingdom
Submission Deadline May 15, 2021
Categories    materials science   industrial engineering   nanotechnology   mechanical engineering
 

Call For Papers

Full Name: 2021 6th International Conference on Material Engineering and Smart Materials (ICMESM 2021)--SCOPUS, Ei Compendex
Abbreviation: ICMESM 2021
Conference website: http://www.icmesm.org/


2021 6th International Conference on Material Engineering and Smart Materials (ICMESM 2021) will be held in London, United Kingdom during July 13-15, 2021.


Conference information:

1. Speakers
Prof. Alexander M. Korsunsky, Vice President, Trinity College, Oxford, UK
Prof. Yuyuan Zhao, University of Liverpool, UK
Prof. Yasuhiko HAYASHI, Okayama University, Japan
Prof. Sotirios Grammatikos, Norwegian University of Science and Technology, Norway

2. Publication
Accepted and registered papers of ICMESM 2021 will be published in ICMSN 2021 Conference Proceedings as a special chapter, which will be indexed by SCOPUS, Ei Compendex (CPX), Chemical Abstracts Service (CAS), REAXYS, Chimica, etc.


4. Submission Methods
(1) Online Submission System(You'll need an account to log in) → http://confsys.iconf.org/submission/icmesm2021
(2) Email box: icmesm@cbees.net

5. Conference Topics:
*Shape Memory Alloys and Polymers
*Electro and Magnetorheological Materials
*Piezomagnetics
*Thermoelectrics
For more topics, please visit: http://www.icmesm.org/cfp.html

6. Conference Venue:
Imperial College London
Address: South Kensington Campus, London SW7 2AZ, UK

7. Contact information
Ms. Elva Zhang
E-mail: icmesm@cbees.net
Tell: +86-28-87577778(Mainland China)
+852-3155-4897(Hong Kong)
Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)

For more detailed information, please visit our website http://www.icmesm.org/.
We are looking forward to your joining in us!


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