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TEI 2008 : Tangible and Embedded Interaction

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Conference Series : Tangible and Embedded Interaction
 
Link: http://tei-conf.org/index.html
 
When Feb 18, 2008 - Feb 21, 2008
Where Bonn, Germany
Submission Deadline Oct 5, 2007
Notification Due Nov 23, 2007
Categories    HCI
 

Call For Papers

Papers must present original material and will be reviewed rigorously by at least 3 reviewers in a double-blind process. Papers in all areas will be reviewed and assessed based on the contribution they make to the field. Submission will be electronic and in ACM SIGCHI format.

Papers can vary in length, using the ACM SIGCHI format and have either 8, 4, or 2 pages. All papers will undergo the same review process and be published in the same way. Length must match the contribution, and the general criteria hold for all papers. Papers can be presented as talk, poster, exhibit or demo, regardless of length. E.g. an exhibit of a novel design can be published as an 8 page paper, while a talk on a novel sensor technique might as a paper fit 2 pages - or vice versa. Authors can indicate what kind of presentation they prefer or suits their contribution.

In case of acceptance, at least one author must register before the early registration deadline for the conference in order for the final paper version to be published in the conference proceedings.

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