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ACM--ICCBN--Ei Compendex, Scopus 2021 : ACM--2021 9th International Conference on Communications and Broadband Networking (ICCBN 2021)--Ei Compendex, Scopus

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Link: http://www.iccbn.org
 
When Feb 25, 2021 - Feb 27, 2021
Where Shanghai, China
Submission Deadline Jan 10, 2021
Categories    communications   information technology   networking   image processing
 

Call For Papers

★ ICCBN 2021-ACM(ISBN: 978-1-4503-8917-4) ★

◥ 2021 9th International Conference on Communications and Broadband Networking ◤
-------------------------------------------------------------------------------
Time: February 25-27, 2021
Place: Shanghai, China
Website: http://iccbn.org


◥ Proceedings
------------
* Accepted papers of ICCBN 2021 will be collected in conference proceedings to be published with International Conference Proceedings ACM(ISBN: 978-1-4503-8917-4), which will be submitted for indexing in Ei Compendex, Scopus, Thomson Reuters Conference Proceedings Citation Index etc. major data bases.

◥ History
----------

* ICCBN 2020 | 15-18 April 2020 | Auckland University of Technology, Auckland, New Zealand
ICCBN 2020 proceedings were archived in ACM Digital Library (ISBN: 978-1-4503-7504-7), and indexed by Ei Compendex & Scopus.

* ICCBN 2019 | 12-15 April 2019 | Nagoya Institute of Technology, Japan
ICCBN 2019 proceedings were archived in ACM Digital Library (ISBN: 978-1-4503-6247-4), and indexed by Ei Compendex & Scopus.

* ICCBN 2018 | 24-26 February 2018 | Singapore
ICCBN 2018 proceedings were included in ACM Digital Library (ISBN: 978-1-4503-6360-0), and indexed by Ei Compendex & Scopus.

* ICCBN 2017 | 20-22 February 2018 | Bali, Indonesia
ICCBN 2017 proceedings were included in ACM Digital Library (ISBN: 978-1-4503-4861-4), and indexed by Ei Compendex & Scopus.


◥ Committees
Jie Li, Shanghai Jiao Tong University, China
Moshe Zukerman, City University of Hong Kong (IEEE Fellow)

Program Chair
Thanh Van Do, Telenor / Oslo Metropolitan University, Norway
Edmund Lai, Auckland University of Technology, New Zealand(IET Fellow, IEEE Senior Member)

International Publicity Committee
Dan Michael A. Cortez, Technological Institute of the Philippines-Quezon City Campus, Philippines
Syed Faraz Hasan,Massey University,New Zealand
Stavros Shiaeles, Plymouth University, United Kimdom

Technical Program Committee
Anthony Brown, The University of Manchester, UK
Xiangning Chen, NanJing University, China
Yongqiang Cheng, The University of Hull, United Kimdom
Hosam El-Ocla, Lakehead University, Canada (IEEE Senior Member)
Chun-I Fan, National Sun Yat-sen University, Taiwan
Hongyuan Gao, Harbin Engineering University, China(IEEE Member)
Fu Hongyan, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, China (IEEE Member)
Wen-Kang Jia, Fujian Normal University, China
Dulani Meedeniya, University of Moratuwa, Sri Lanka(IEEE Member)
Amanda Peart, University of Portsmouth, United Kimdom
Yusnita Rahayu, University of Riau, Indonesia(IEEE Senior Member)
Hui-Kai Su, National Formosa University, Taiwan. (IEEE Member)
June Tay, Singapore University of Social Sciences, Singapore
Pei-Yih Ting, National Taiwan Ocean University, Taiwan
Takeshi Tsuchiya, Suwa University of Science, Japan(IEEE Member)
Chun-Hsin Wu, National University of Kaohsiung, Taiwan
Liwei Yang, China Agricultural University, China

◥ Keynote Speakers and Invited Speakers
Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada
Prof. Moshe Zukerman, IEEE Fellow, City University of Hong Kong, Hong Kong
Prof. Edmund Lai, IET Fellow, IEEE Senior Member, Auckland University of Technology, New Zealand
Prof. Kan Wu,Shanghai Jiao Tong University, China
Prof. Thanh Van Do, Telenor / Oslo Metropolitan University, Norway


★Submission
1. Full paper (publication and presentation)
Full paper with at least 8 pages to 10 pages is requested, if you are also considering publishing your paper.
2. Abstract (only presentation)
If you just want to make an oral presentation without paper publication, then you can only submit an abstract within 300-500 words.

Submission Online System:
For submission, please upload it to the Submission System (.pdf): http://confsys.iconf.org/submission/iccbn2021
If you have any difficulties, please directly email your paper to iccbncontact@vip.163.com


◥ Contact Us
-----------
Yu Liu(Lauren)
Email: iccbncontact@vip.163.com

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