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AITIJ 2021 : Advances in Interconnect Technologies: An International Journal

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Link: http://airccse.com/aitij/index.html
 
When N/A
Where N/A
Submission Deadline Jun 26, 2021
Notification Due Jul 26, 2021
Final Version Due Aug 5, 2021
Categories    wireless   neural networks   emerging materials   interconnect technologies
 

Call For Papers

Advances in Interconnect Technologies: An International Journal (AITIJ)

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include but are not limited to, the following

  • Emerging Materials
  • CNT/ Graphene Interconnects
  • Modeling and Simulation
  • Testing
  • RFIC
  • Optical Interconnects
  • Wireless Interconnects
  • Microstrip Lines
  • Analog and Mixed Signals
  • Dedicated Software and Systems for Developing Interconnect Technology
  • On-Chip and Off-Chip Interconnects
  • EMC/EMI
  • FPGA/ASICs
  • Fabrication Techniques
  • Neural Networks
  • Parasitics Issues
  • Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through E-mail aitijjournal@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates

Submission Deadline:June 26, 2021
Authors Notification:July 26, 2021
Final Manuscript Due:August 05, 2021
Publication Date:Determined by the Editor-in-Chief

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