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HOTI-POSTER 2020 : 27th International Symposium on High Performance Interconnects 2020


When Aug 19, 2020 - Aug 21, 2020
Where San Jose, CA
Submission Deadline Jul 13, 2020
Notification Due Jul 20, 2020
Categories    interconnection   network   hpc system   data center

Call For Papers

27th International Symposium on High Performance Interconnects 2020
QCT, San Jose, California, August 19-21, 2020

Safety and Well-Being
HOT Interconnects is scheduled to be held as planned, beginning on August 19.
Given the uncertainty of the Coronavirus, we are planning for a virtual, online
conference but we are also holding open the possibility of a physical conference.

The safety and well-being of all conference participants is our priority. We
will continue to monitor official travel advisories related to the Coronavirus
and update the event website to keep you informed. We encourage you to review
the conference’s “Travel and Safety Information” page for tips and travel
recommendations. If you have any questions or need additional information,
please email us for further details:

As well as a Travel and Safety Information page with these links:

World Health Organization:
Centers for Disease Control:
European Center for Disease Control:
National Health Commission of the People’s Republic of China:

Call for Posters

Hot Interconnects is the premier international forum for researchers and
developers of state-of-the-art hardware and software architectures and
implementations for interconnection networks of all scales, ranging from
multi-core on-chip interconnects to those within systems, clusters, data
centers, and clouds. This yearly conference is attended by leaders in
industry and academia. The atmosphere provides for a wealth of
opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking
technologies, and communication protocols for high-performance
interconnection networks. This conference is directed particularly at new
and exciting technology and product innovations in these areas.
Contributions should focus on real experimental systems, prototypes, or
leading-edge products and their performance evaluation.

This year, we are inviting poster abstract submissions. Abstracts will consist
of a one page description of the proposed poster and should highlight
technical merit, relevance to HotI, and novelty of the content. Additionally,
abstracts should include title and author information.


* Poster abstract deadline: July 13th, 2020
* Poster notification of acceptance: July 20th, 2020

To submit, go to​
Topics of interest include, but are not limited to:

* Novel and innovative interconnect architectures
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Advanced chip-to-chip communication technologies
* Optical interconnects Protocol and interfaces for inter-processor
* Survivability and fault-tolerance of inter-connects
* High-speed packet processing engines and network processors
* Systems software for communication
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Pb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud & grid computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance interconnects
* Traffic characterization for HPC systems and commercial data centers
* Software-defined networking and software overlay networks
* Software for network bring-up, configuration and performance management
(OpenFlow, OpenSM)
* Data Center Networking

Sponsor HOT Interconnects! email the Sponsorship chair, Raj Channa

Send questions relating to the conference operation to:

Co-General Chairs:

Khaled Hamidouche, AMD
Don Draper, ProPrincipia International Associates


Send questions relating to the program to


Manjunath Gorentla Venkata, Mellanox Technologies, Inc
Ryan E. Grant, Sandia National Laboratories


Sponsored by the IEEE Computer Society Technical Committee for
Microprocessors and Microcomputers

Sister conferences:

Go to the HOT Interconnects web site for updates:

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