posted by user: kriglstein || 729 views || tracked by 5 users: [display]

TEI 2021 : 15th International ACM Conference on Tangible, Embedded, and Embodied Interaction

FacebookTwitterLinkedInGoogle


Conference Series : Tangible and Embedded Interaction
 
Link: https://tei.acm.org/2021/papers/
 
When Feb 14, 2021 - Feb 17, 2021
Where Salzburg, Austria
Abstract Registration Due Jul 24, 2020
Submission Deadline Aug 7, 2020
Notification Due Oct 9, 2020
Categories    design   interaction design   tangible interaction   embodiment
 

Call For Papers

TEI2021 is the 15th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. The ACM-TEI conference has gained substantial visibility and activity over the past decade. It brings together researchers, practitioners, businesses, artists, designers and students from various disciplines, including engineering, interaction design, computer science, product design, media studies and the arts.

This year TEI comes to Austria, which has a long tradition of digital art. Our theme for 2021 is The Art of Interaction. The theme invites participants to speculate on a vision of how art impacts, inspires and shapes interaction. We consider art in the broadest sense: from physical to virtual works as well as across all genres, such as interactive installations, performance, visual art, and (tangible) sculptures.

Topics and application areas are diverse, including: tangible user interfaces, physical interaction design, flexible and shape changing displays, haptic interaction, smart objects and cities, interactive surfaces, augmented and mixed reality, ubiquitous computing, interactive art and performance, social and wearable robotics, hybrid games, embodied cognition and perception, fashion and material design, furniture and architectural design, learning and education, music and sound interfaces, human-augmentation, as well as productivity and creativity tools in domains ranging from scientific exploration to artistic practice. We invite submissions from a wide variety of perspectives: theoretical, philosophical, conceptual, technical, applied, and/or artistic.

The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, demonstrations, posters, art installations and performances, and participation in hands-on studios and theoretical workshops.

CONTRIBUTION TYPES
Authors are invited to submit high-quality papers that contribute to advancing this rapidly developing field. The length of a submission should be commensurate with its contribution. The shortest version of your paper is probably the best. Previous TEI papers had between 4-10 pages in the ACM two-column format, not including references.

We highlight the following non-exclusive set of contribution types:

Artefact: We welcome submission of research artefacts that advance the state of the art in Tangible, Embedded and Embodied Interaction. Artefacts can demonstrate new technologies (e.g., new sensing techniques or algorithms), new forms of input (e.g., novel interaction techniques) or new designs (e.g., provocative or evocative objects, systems or services).

Method: Tools, approaches and techniques that enable researchers, technologists, designers and practitioners to study, research and work on Tangible, Embedded and Embodied Interaction. Methods can include new forms of study design or data analysis, new engineering processes or frameworks that can structure and constrain generative design activity.

Theory: Explorations, extensions, refutions, instantiations and other developments of and to the theories pertaining to Tangible, Embedded and Embodied Interaction, such as theories of cognition or the mind and designerly theories and conceptual frameworks.

Empirical: Studies and data that add to our understanding of Tangible, Embedded and Embodied Interaction by, for example, providing quantitative accounts of salient aspects of human performance or qualitative characterizations of experiences with tangible artefacts and systems. Empirical submissions can detail outcomes from a very wide range of lab, field and online studies.

Respecting the diversity of approaches and methods that together make up TEI, each contribution type will be peer-reviewed on its own merits. We seek high-quality work regardless of the specific subdomain or topic and we expect the work to be positioned firmly in, and building on, prior research in our field, in particular wherever relevant referencing work that was presented at earlier TEI conferences.

Accepted submissions of all contribution types will be included as papers in the conference proceedings, which will be available in the ACM Digital Library.

Further information about submission procedures, templates, the reviewing process and types of presentations will be released on the conference website: tei.acm.org

We hope to see you in Salzburg!

Program committee chairs:
Ian Oakley (Ulsan National Institute of Science and Technology, South Korea)
Katrin Wolf (Beuth University of Applied Sciences, Germany)

RELATED DATES
December 15, 2020 ACM-W Scholarships for Attendance at Research Conferences

Related Resources

IUI 2021   ACM Intelligent User Interfaces 2021
Scopus/EI-D2ME 2020   5th International Conference on Design, Mechanical and Material Engineering (D2ME 2020)
TEI 2020   Tangible and Embedded Interaction
ETIS 2020   Fourth European Tangible Interaction Studio
Scopus-ICMEAS 2020   6th International Conference on Mechanical Engineering and Automation Science (ICMEAS 2020)
VLSICS 2020   International Journal of VLSI design & Communication Systems
ACM--ESSE--Ei Compendex, Scopus 2020   ACM--2020 European Symposium on Software Engineerings (ESSE 2020)--Ei Compendex, Scopus
DLI 2020   (Virtual) 5th EAI International Conference on Design, Learning & Innovation
IEEE--ICISE--Ei Compendex & Scopus 2020   IEEE--2020 the 5th International Conference on Information Systems Engineering (ICISE 2020)--Ei Compendex & Scopus
ACHI 2020   The Thirteenth International Conference on Advances in Computer-Human Interactions