INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing
Call For Papers
The 2020 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.
2020 INTERCON will GO VIRTUAL!
Topics of interest include, but are not limited to:
Semiconductor and devices
Computers and information technology
Systems and control
Circuits and systems
Power generation, transmission and distribution
Renewable energy sources, smartgrids technologies and applications
Power electronics, systems and applications
Electrical machines and adjustable speed drives
High voltage engineering and insulation technology
Algorithms and complexity
Architecture and organization
Graphics and visualization
Information management, assurance and security
Parallel and distributed Computing
Social issues and professional practice
The official language of INTERCON is ENGLISH. The maximum number of authors per paper is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
We will use EasyChair system for submissions here:
Every accepted paper will need one associated full registration for being included in the conference technical program and proceedings.
As it is mandatory for any IEEE conference, we will implement a strict “No Show No Publication” policy, meaning that accepted papers that are not presented at the conference will not be submitted for publication in IEEE Xplore. Such presentations must be done virtually, so participants and authors can talk and interchange their experiences and views. Technical discussions are a precious element of quality of our conference.
All the papers submitted through EasyChair will be peer reviewed and all of the accepted papers, if they are presented at 2020 INTERCON, will be submitted for publication in IEEE Xplore.
Technical Program Chair:
Sponsored by: IEEE Peru Section (www.ieee.org.pe)
Supported by: Tecsup Lima IEEE Student Branch