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INTERCON 2020 : IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing

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Link: http://www.intercon.org.pe
 
When Sep 3, 2020 - Sep 5, 2020
Where Lima, Peru
Submission Deadline Jun 15, 2020
Notification Due Jul 31, 2020
Final Version Due Aug 9, 2020
 

Call For Papers

The 2020 IEEE XXVII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

2020 INTERCON will GO VIRTUAL!

Topics of interest include, but are not limited to:
Communication systems
Semiconductor and devices
Computers and information technology
Signal processing
Systems and control
Emerging technologies
Circuits and systems
Power generation, transmission and distribution
Renewable energy sources, smartgrids technologies and applications
Power electronics, systems and applications
Electrical machines and adjustable speed drives
High voltage engineering and insulation technology
Algorithms and complexity
Architecture and organization
Graphics and visualization
Information management, assurance and security
Intelligent systems
Parallel and distributed Computing
Software engineering
Social issues and professional practice

Submission
The official language of INTERCON is ENGLISH. The maximum number of authors per paper is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
https://www.ieee.org/conferences/publishing/templates.html

We will use EasyChair system for submissions here:
https://easychair.org/conferences/?conf=2020ieeeintercon

Registration
Every accepted paper will need one associated full registration for being included in the conference technical program and proceedings.

Publication
As it is mandatory for any IEEE conference, we will implement a strict “No Show No Publication” policy, meaning that accepted papers that are not presented at the conference will not be submitted for publication in IEEE Xplore. Such presentations must be done virtually, so participants and authors can talk and interchange their experiences and views. Technical discussions are a precious element of quality of our conference.
All the papers submitted through EasyChair will be peer reviewed and all of the accepted papers, if they are presented at 2020 INTERCON, will be submitted for publication in IEEE Xplore.

Organizing Committee
Conference Chair:
César Gallegos
cgallegos@ieee.org

Technical Program Chair:
Carlos Silva
csilva@pucp.edu.pe

Publication Chair:
José Durán
joseduran@ieee.org

Conference Treasurer:
Carlos Chancafe
cchancafe@ieee.org

Information Contact:
Eyner Mesones
emesones@ieee.org

Sponsored by: IEEE Peru Section (www.ieee.org.pe)
Supported by: Tecsup Lima IEEE Student Branch

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