About the Event

Organized by IFSA - non-profit, professional association, serving for academy and industry since 1999, the MicDAT’ 2026 conference is intended to highlight the growing impact of modern microelectronic technologies and to improve understanding of the latest scientific, engineering, and market-driven challenges across a broad range of applications. The event’s scope is to outline key technology platforms and manufacturing routes for advanced microelectronic devices, SoC and SiP solutions, heterogeneous integration and advanced packaging, as well as MEMS and NEMS technologies enabling next-generation sensing and actuation.

Recognized experts from both academia and industry will be invited to share their perspectives and real-world experience in selected application domains, including energy-efficient computing and AI hardware, high-frequency and communication systems, automotive and industrial electronics, power and energy solutions, and reliable embedded systems. With strong participation from research and industry communities, MicDAT’ 2026 will provide an excellent opportunity to exchange ideas, present recent breakthroughs, and discuss pathways from research to scalable products.

The aim of the MicDAT conference series is to serve as an annual international forum for presenting and discussing recent advances in microelectronics and to bring together researchers, engineers, and practitioners working on microelectronics-related technologies. MicDAT’ 2026 will feature plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products and tools. Social and cultural events will also take place to foster networking among participants in a friendly atmosphere. The conference is coordinated with the IFSA series of conferences, which address physics and engineering.

The MicDAT' 2025 will be held in co-located with the 12th International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2026) under the same conference umbrella.

We trust that you will find MicDAT' 2026 conference professionally rewarding and stimulating as well as enjoyable.

Submission Guidelines:

All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:

* Regular papers
* Posters
* Special sessions papers
* Keynote presentations
* Invited talks
* Industrial presentations
* Exhibition

Papers must be prepared according to the conference proceedings template:
https://sensorsportal.com/MicDAT_2026/MicDAT_2026_abstract_and_paper_template.docx

Posters size: A0 (21 x 29.7 cm), vertical orientation

List of Topics:

* Analog, digital, mixed, and RF circuits and related design methodologies
* Analog-to-Digital Converters (ADC)
* Voltage-to-Frequency Converts (VFC)
* Frequency-to-Digital Converters (FDC)
* Time-to-Digital Converters (TDC)
* Semiconductor Devices: physics and technology
* Circuit Theory and Applications
* Active and Passive Electronic Components
* Logic, architectural, and system level synthesis
* Nonlinear circuits
* Microprocessors, microcontrollers and DSPs
* Testing, design for testability, built-in self-test
* Area, power, and thermal analysis and design
* Mixed-domain simulation and design
* Embedded systems, low-power designs
* VLSI Circuit and Systems design
* Non-von Neumann computing and related technologies and circuits
* Design and test of high complexity systems integration
* SoC, MPSoC, NoC, SIP, and NIP design and test
* Process technologies, CMOS, BJT, BiCMOS, GaAs
* 3-D integration design and analysis
E* merging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
* Design for Manufacturability/Technology Optimization/Yield & Quality
* Microelectronics processing and materials
* Semiconductor processing
* Modern electronics materials
* Solid-state electronics
* Quantum electronics
* Thin solid films
* Nanoprocessing, nanotechnology and nanofabrication​
* Nanoelectronics and Spintronics
* Flexible and stretchable electronics​
* MEMS, MOEMS and NEMS
* Computer-Aided Design (CAD) of Integrated Circuits
* Hardware/software co-design
* Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
* Electronic materials science and technology
* Electronics Cooling and Thermal Control
* Optoelectronics
* Organic electronic materials and devices
* Microelectronics reliability and qualification
* Assembly and Packaging


Special Sessions:

Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.

Session organizers will get:

* Certificate of appreciation
* Free registration for the event


Publication:

One event - three different publications !

1) All registered abstracts will be published in the conference proceedings with the ISBN and DOI, distributed during the conference and submitted for indexing to the Web of Science and SCOPUS.

2) Authors will be invited to submit full-page extended papers to the special issues of Sensors & Transducers open access journal or in others indexed affiliated open access journals.

3) Final papers and/or journal's article may be extended for book chapters for the open access Book Series on 'Advances in Microelectronics', Vol. 4.