Therminic 2018 : Therminic

posted by organizer: mccberlin || 5361 views || tracked by 3 users: [display]

Therminic 2018 : Therminic

Link: http://therminic2018.eu/

When	Sep 26, 2018 - Sep 28, 2018
Where	Stockholm
Submission Deadline	Apr 11, 2018
Notification Due	Jun 15, 2018
Final Version Due	Aug 8, 2018

Categories nanotechnology electronics engineering simulations

Call For Papers

THERMINIC is the major European Workshop for thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events. We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics:
• Thermal Phenomena, Simulation and Experiment
• Electronics Cooling Concepts
• Thermo-Mechanical Reliability

Related Resources

Therminic 2025 Therminic 2025

Ei/Scopus-CMLDS 2026 2026 3rd International Conference on Computing, Machine Learning and Data Science (CMLDS 2026)

ICIAI 2026 2026 the 10th International Conference on Innovation in Artificial Intelligence (ICIAI 2026)

ISCSO 2025 Multi-Objective Optimization Competition

ToMS 2025 Transactions on Maritime Science journal

NTIJ 2025 Nanoscience and Technology: An International Journal

IEEE-EI/Scopus-EIECC 2025 2025 5th International Conference on Electronic Information Engineering and Computer Communication-IEEE Xplore/EI/Scopus

IJPLA 2025 International Journal of Programming Languages and Applications

AVC 2025 Advances in Vision Computing: An International Journal

ICARA 2026 2026 The 12th International Conference on Automation, Robotics and Applications (ICARA 2026)