posted by user: TMS || 3961 views || tracked by 4 users: [display]

LMPC 2013 : 2013 Liquid Metal Processing & Casting Conference (LMPC)

FacebookTwitterLinkedInGoogle

 
When Sep 22, 2013 - Sep 25, 2013
Where Austin, TX, USA
Submission Deadline Jan 11, 2013
Categories    materials   science   engineering   metals
 

Call For Papers

Abstracts are now being accepted for the Liquid Metal Processing & Casting Conference 2013 (LMPC 2013). Both academic and industrial papers are sought in areas such as advances in controls and process simulation, ingot defect formation and characterization studies, and process parameter-material properties characterization.

The program will include, but is not limited to, the following topics:

Primary and secondary melt processing, including VIM, VAR, ESR, EBCHR, plasma melting
Physical property measurements of liquid metals
Casting and solidification of liquid metals
Modeling of metallurgical processes including heat/mass flow modeling of liquid metal and solidification
Ceramic, slag and refractory reactions with liquid metals
Refining, evaporation and gas/metal reactions
Fundamentals of reactions involving liquid metals in productions processes

Related Resources

CAEPIA 2026   CAEPIA 2026: XXI Conference of the Spanish Association of Artificial Intelligence
AIxSET 2026   International Conference on AI x Science, Engineering, and Technology
AIChE Spring Meeting & GCPS 2026   2026 AIChE Spring Meeting & 22nd Global Congress on Process Safety
MSE 2026   10th International Conference on Materials Science and Engineering
ACM ICBRA 2026   ACM--2026 13th International Conference on Bioinformatics Research and Applications (ICBRA 2026)
ToMS 2026   Transactions on Maritime Science journal
ICBRA 2026   ACM--2026 13th International Conference on Bioinformatics Research and Applications (ICBRA 2026)
NeTCoM 2026   18th International Conference on Networks & Communications
IJMECH 2026   International Journal of Recent Advances in Mechanical Engineering
IJSC 2026   International Journal on Soft Computing - H-Index:26