Call for Papers
The 2012 International Conference on Embedded System and Microprocessors (ICESM 2012) is the premier forum for the presentation of new advances and research results in the fields of Embedded System and Microprocessors. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include all design and architectural aspects related to embedded systems hardware. It includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processors on a chip (MPoC) as well as their communication methods, such as network-on-chip (NoC).

Design automation of such systems including methodologies, techniques and tools for their design as well as novel designs of hardware components fall within the scope of this conference. Novel applications that use embedded systems are also central in this conference. While software is not a part of this conference hardware/software co-design methods that consider interplay between software and hardware components with emphasis on hardware are also relevant here.

Benefits of the Conference

Keep up-to-date on the latest advances in the field.
Present your research within a unique forum.
Collaborate with experts from around the world.
Submitted conference papers will be reviewed by technical committees of the Conference.
This year, all accepted and presented papers will also be published in the Advanced Materials Research Journal (ISSN: 1022-6680).

Advanced Materials Research (ISSN: 1022-6680) is Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.

Any problems please feel free to contact icesm@vip.163.com.

Submission Methods:

Formatting Instructions Format (DOC)

1. Electronics Submission System;

2. Email: icesm@vip.163.com.