About the EOS/ESD Symposium
The ESD Association, in cooperation with IEEE, is sponsoring
the 34th Annual Symposium on Electrical Overstress (EOS) and
Electrostatic Discharge (ESD) effects. The Symposium will
be dedicated to the understanding of issues related to electrical
transients and electrical overstress, and the application of this
knowledge to the solution of problems in consumer, industrial
and military applications, including electronic components and
manufacturing, as well as in systems, subsystems and
equipment.
Technical Papers
The Technical Program Committee solicits paper contributions,
including data and analysis that advance the state-of-the-art
knowledge, enhance or review the general knowledge, or
discuss new topics related to EOS/ESD. Paper Presentations at
the Symposium will be in electronic Power Point® format.
Abstracts
Authors must submit a 50-word abstract and 4-page
(maximum) summary of their work. The summary must
clearly state the purpose, results (e.g., data, diagrams,
photographs, etc.), and conclusions of the work. Summaries
must also include references to prior publications and state how
the work enhances existing knowledge. Authors must designate
the appropriate technical area related to their work and
submission. See reverse for suggested, but not restricted, topic
listings. Authors are encouraged to use the abstract
submission toolkit available on the ESD Association’s
website www.esda.org.
Presentation of work at the International ESD Workshop (IEW)
will not preclude an abstract submission, as long as the
submission follows the EOS/ESD Symposium guidelines. If the
IEW work is submitted to the EOS/ESD Symposium, it is
required that the IEW work is expanded upon significantly (e.g.
50% increase of data graphs) in the abstract submission for the
EOS/ESD Symposium in order to be considered for acceptance.
Electronic Submissions
Abstract submissions shall be made electronically via an
emailed PDF file to info@esda.org. One file for each
submission is required.
Paper Acceptance
The Technical Program Committee will accept unpublished
papers for peer review with the understanding that the author
will not publish elsewhere the work prior to presentation at the
Symposium. Accepted papers published in any form prior to
presentation at the Symposium may result in the paper being
withdrawn from the Symposium Proceedings. Authors must
obtain appropriate company and government clearances prior to
submitting their abstracts.
Paper Awards and Recognition
Awards are presented annually for the Symposium Outstanding
Paper (selected by Symposium attendees), the Best Paper
(selected by the Technical Program Committee), and the Best
Student Paper. The Best Paper is considered for presentation at
the RCJ EOS/ESD Symposium in Japan. Either Best Paper or
Symposium Outstanding Paper will also be selected for
presentation at the SMTA International Conference. Eligible
student contributions for the Best Student Paper Award should
be marked as such by the authors at the time of abstract
submission.
Deadlines
The submission deadline is Friday, January 13, 2012.
Abstracts not meeting guidelines may not be accepted.
The final submission deadline for the finished papers will be
Friday, June 15, 2012. ESDA reserves the right to withdraw
any paper not meeting the guidelines, including deadlines.
Your paper MUST be submitted by the deadline. Final
papers will be limited to a maximum of 10 pages - guidelines
will be provided after acceptance of the paper.

Accepted papers covering selected topics may be considered for review for invited publications in
IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Transactions on Electron
Devices, the Micro-Electronics Reliability Journal, the Journal of Electrostatics or other
appropriate publications.

Papers are solicited in the following areas:
I. Component Level EOS/ESD
 On-Chip Protection Devices & Techniques  EOS/ESD Failure Analysis  ESD Device and Circuit Simulation
 IC Design and Layout Issues  Transmission Line Pulse and
Other Testing Methods
 Modeling and Physics of EOS/ESD
 ESD & Latchup, or other Reliability Aspects  Processing Issues and Effects  RF Devices and Circuits
 ESD in Advanced Technologies (Multi-gate,
SOI, SiGe, Compound Semiconductors,
Carbon Nano-tubes, etc.)
 New ESD Phenomena in MEMS
(Microelectromechanical Systems)
 High Voltage, High Power
Technologies (BiCMOS, HV CMOS)
II. System Level EOS/ESD
 Simulators, Calibration and Correlation  Case Studies, Reviews and Analysis
 Optical Networks ESD  Test Methods and Procedures
 ESD Detection and Measurement Techniques  Modeling and Simulation
 ESD Electronic Design Automation (EDA)  Transient ESD/EMI Induced Upset
Ill. EOS/ESD Factory Level and Materials Technology
 Packaging and Handling  Case Studies, Reviews and Analysis
 Test Methods and Procedures  Troubleshooting Techniques
 Air Ionization and Uses  Management Issues (cost/benefit analyses, etc.)
 Facility Design  ESD Shunting Packaging Technology
 ESD Control Materials  Chemistry
 Use of Antistatic Materials
IV. Electrostatic Control
 Biomedical & Chemical Industry Electrostatic Control  Graphic Arts Electrostatic Control
 ESD Control in Explosives and Pyrotechnics  Oil/Petroleum Industry Electrostatic Control
 Aircraft, Spacecraft and Avionics ESD
V. Magnetic Recording Heads and Ultra Sensitive Devices
 Testing and Analysis  Protection Techniques
 Special Considerations for Extremely Sensitive Devices  Failure Analysis Techniques and Interpretations
VI. ESD Standards – Components, System, Factory & Materials
 Test Methods and Procedures  Round-Robin Testing, Results and Analysis
 Standards - Comparisons and Analysis  Case Studies

Contact addresses for questions or further information:
ESD Association
Lisa Pimpinella
ESD Association
7900 Turin Road, Building 3
Rome, NY 13440 USA
Phone: (+1)315-339-6937 Fax: (+1)315-339-6793
e-mail: info@esda.org
Technical Program Chair
Harald Gossner
Intel Mobile Communications
Am Campeon 1
85579 Neubiberg, Germany
Phone: (+49)-89-998853-22384
e-mail: harald.gossner@intel.com