posted by user: claesen || 8426 views || tracked by 4 users: [display]

ECTC 2012 : IEEE 62nd Electronic Components and Technology Conference

FacebookTwitterLinkedInGoogle

Link: http://www.ectc.net
 
When May 29, 2012 - Jun 1, 2012
Where San Diego, USA
Submission Deadline TBD
Categories    electronic components
 

Call For Papers

About ECTC
A Premier Event....

The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information. This year’s conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. The 61st ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA from May 31 - June 3, 2011.

The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are Used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards. Committee Information

The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies.

The Panel Discussion, Plenary Session, and CPMT seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.

The Technology Corner complements the Technical Program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.

The ECTC would not be possible without the sponsorship of the IEEE Components, Packaging, and Manufacturing Technology Society, numerous corporate participants and sponsors, and the time and energies of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.

Related Resources

IEEE ICEIT 2026   IEEE--2026 the 15th International Conference on Educational and Information Technology (ICEIT 2026)
ICEIT 2026   IEEE--2026 the 15th International Conference on Educational and Information Technology (ICEIT 2026)
DSIT 2025   2025 IEEE 8th International Conference on Data Science and Information Technology (DSIT 2025)
IEEE-ADMIT 2025   2025 IEEE 4th International Conference on Algorithms, Data Mining, and Information Technology (ADMIT 2025)
ITA 2026   International Congress on Information, Technology and Applications
EduTeach 2025   9th Canadian Conference on Advances in Education, Teaching & Technology 2025
SANER 2026   The 33rd IEEE International Conference on Software Analysis, Evolution and Reengineering
CIFEr 2026   IEEE Computational Intelligence in Financial Engineering and Economics
BigData 2025   2025 IEEE International Conference on Big Data
IEEE CAIT 2025   IEEE--2025 6th International Conference on Computers and Artificial Intelligence Technology (CAIT 2025)