Home Categories
CFPs Conf Series
My List
My Archive
On iPhone
On Android
posted by system || 2918 views || tracked by 2 users: [display]

EDAPS 2008 : Electrical Design of Advanced Packaging and Systems Symposium

FacebookTwitterLinkedInGoogle

Link: http://www.edaps2008.org/Contents/Callforpaper.asp%20globalmenu=5&localmenu=1
 
When Dec 10, 2008 - Dec 12, 2008
Where Seoul, South Korea
Submission Deadline Jul 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

IEEE ICPIES 2027   2027 IEEE 3rd International Conference on Power and Integrated Energy Systems (ICPIES 2027)
MSEJ 2026   Advances in Materials Science and Engineering: An International Journal
IJME 2026   International Journal of Microelectronics Engineering
ICCRT 2026   2026 4th International Conference on Control and Robot Technology (ICCRT 2026)
AIEE--EI 2026   2026 7th International Conference on Artificial Intelligence in Electronics Engineering (AIEE 2026)
AIMLM 2026   2026 International Conference on Artificial Intelligence, Machine Learning and Multimodality
ISMSI--EI 2027   2027 11th International Conference on Intelligent Systems, Metaheuristics & Swarm Intelligence (ISMSI 2027)
AMMEM 2026   2026 2nd International Conference on Advanced Materials, Mechanical Engineering, and Manufacturing
ICPIES 2027   2027 IEEE 3rd International Conference on Power and Integrated Energy Systems (ICPIES 2027)
ICMSCE 2026   Springer--2026 8th International Conference on Mechatronics Systems and Control Engineering (ICMSCE 2026)
About Us | Contact Us | Data | Privacy Policy | Terms and Conditions
Partners: AI2's Semantic Scholar
This wiki is licensed under a Creative Commons Attribution-Share Alike 3.0 License.