posted by system || 2574 views || tracked by 2 users: [display]

IMPACT 2008 : 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.

FacebookTwitterLinkedInGoogle

Link: http://www.impact-emap.org/2008/CallPaper/
 
When Oct 22, 2008 - Oct 24, 2008
Where Taipei, Taiwan
Submission Deadline May 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

3rd IFIMITAI 2026   Loxbridge High-Tech Forum series on IT & AI for business, management, finance, industries, innovation and education
EI/Scopus-STIE 2026   2026 International Conference on Sensor Technology and Information Engineering-EI/Scopus
AIChE Spring Meeting & GCPS 2026   2026 AIChE Spring Meeting & 22nd Global Congress on Process Safety
EI/Scopus-AEME 2026   2026 International Conference on Aerospace Engineering and Mechanical Engineering-EI/Scopus
IMPACT.AI 2026   Intelligent Management, Pedagogy, and Collaborative Transformation through AI Conference
ICCRT 2026   2026 4th International Conference on Control and Robot Technology (ICCRT 2026)
IMPACT AI 2026   Intelligent Management, Pedagogy, and Collaborative Transformation through AI Conference
ICMERR 2026   2026 the 10th International Conference on Mechanical Engineering and Robotics Research (ICMERR 2026)
MLIC 2026   2026 3rd International Conference on Machine Learning and Intelligent Computing
AI & FL 2026   14th International Conference of Artificial Intelligence and Fuzzy Logic