Call for papers:
The 8th Asia Conference on Cognitive Engineering and Intelligent Interaction (CEII 2025)

The 8th Asia Conference on Cognitive Engineering and Intelligent Interaction (CEII 2025) will be held during December 19-21, 2025 in Hong Kong, China. CEII was initiated in 2018 and held in Shanghai. It has been successfully held for four editions as a workshop in Shanghai AI Submit (SHAI2018).
Last year, CEII 2024 was successfully held in Nanyang Technological University, for more infromation you can view at: https://ceii.asia/2024.
We will be really glad if you could participate in our event in 2025 which will be a platform of interactions for experts around the world and aims to accelerate scientific discoveries. The theme of the conference is Optimizing the Demand of Artificial Intelligence with the Help of Recent Technologies covering a wide extent to serve the speakers to showcase their highly insightful research work, knowledge from the field of Cognitive Engineering and Intelligent Interaction to the audience and participants. Our aim is to bring global scientists / researchers and doctors to one platform to share updated information, Innovation and compliance with regulatory guidelines are the most critical aspects in the field of AI.

Description
Full name: The 8th Asia Conference on Cognitive Engineering and Intelligent Interaction
Abbreviation: CEII 2025
Date: December 19-21, 2025
Place: Hong Kong, China
Website: https://ceii.asia/

Important Date
Full Paper Due: November 21, 2025
Conference Date: December 19-21, 2025

Publication
All papers submitted in CEII 2025 will be reviewed by Technical Committees of the conference. Accepted and presented papers will be included in the CEII 2025 conference proceedings which will be published by Conference Publishing Services (CPS) and submitted to the indexing companies for possible indexing, such as EI compendex, Scopus, etc.

Organizing Committees
Honorary Chair
Prof. Ching Yee Suen (IEEE Fellow, IAPR Fellow, RSC Fellow), Concordia University, Canada
Conference Chair
Prof. Ming Xie, Nanyang Technological University, Singapore
Program Committee Chair
Prof. Huiyu Zhou, University of Leicester, UK
Assoc. Prof. Yinqiang Zheng, The University of Tokyo, Japan
Program Committees Co-Chairs
Prof. Kin Fun Li (IEEE Senior Member), University of Victoria, Canada
Prof. Connie Yuen (IEEE & ACM Senior Member), Hong Kong College of Technology(HKCT), Hong Kong, China
Asst. Prof. Hugo Wai Leung MAK, The Chinese University of Hong Kong & The Hong Kong University of Science and Technology, Hong Kong, China
Publication Chair
Asst. Prof. Ruidan Su (IEEE Senior Member), Shanghai Jiao Tong University (SJTU), China
Publicity Chair
Dr. Dongkun Han, The Chinese University of Hong Kong, Hong Kong, China
Finance Chair
Prof. Zhiquan Liu, Jinan University, China
For more information, please click on: https://ceii.asia/committee.html

Keynote Speakers
Prof. Lap-Pui Chau, IEEE Fellow, The Hong Kong Polytechnic University, Hong Kong, China
Prof. Hisao Ishibuchi, IEEE Fellow, Southern University of Science and Technology, China
Prof. Jiawei Jia, Chair Professor, IEEE Fellow, Beijing Normal University, (BNU-Zhuhai), China
Prof. Benjamin W. Wah, IEEE Life Fellow, Chinese University of Hong Kong, Hong Kong, China
Prof. Hong Zhang, Chair Professor, IEEE Fellow, CAE Fellow, Southern University of Science and Technology (SUSTech), China
For more speakers please kindly find out at: : https://ceii.asia/Keynote.html

Call for papers
Topics of interest include, but are not limited to:
Artificial Intelligence and Soft Computing
Cognitive Science and Computational Biology
Cognitive Engineering and Human-AI Teaming
Extended Interaction
Models and Systems 
Computer vision & image processing/recognition
For more detailed content, please click on: https://ceii.asia/cfp.html

Submission Methods
Please choose one way to submit your contributions.
1) Open conference submission system: https://ceii.asia/openconf/openconf.php
2) Email: cfp@ceii.asia

Contact Us
Conference Secretary: Damone
Email: cfp@ceii.asia
Whatsapp: +86-13310183307