The 28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2027) will take place from April 11–14, 2027 in Regensburg, Germany.

EuroSimE addresses fundamental research and industrial applications related to thermal, mechanical and multiphysics simulation and experiments of micro- and nano-electronics and microsystems.

Topics include:

Single Domain Simulation
• Thermal, mechanical and thermo-mechanical simulation
• Vibration and shock
• Chip-package-board interaction
• Advanced numerical and analytical simulation methods and tools
• Compact Modelling and Model Order Reduction
• Digital Twins
• Advanced thermal management concepts

Material Characterization and Validation
• Material characterization, experiments and modelling
• Bulk and interface toughness
• Experimental validation of simulation models
• Failure analysis and failure mode extraction
• Failure criteria and damage modelling for reliability prediction

Application Domains
• Electronic components, packaging and system integration
• Aerospace, automotive, energy, lighting and medical applications
• MEMS sensors and actuators
• Opto-electronic and opto-mechanical devices
• Nano-electronic mechanical devices
• Consumer electronics

Multiphysics Simulation
• Multiphysics simulation
• Multi-scale modelling and simulation
• Integrated process modelling
• Simulation-based optimization
• Virtual prototyping and prequalification
• Heterogeneous integration

Emerging Modelling Methods and Tools
• Prognostics and Health Management
• Artificial Intelligence and Machine Learning
• Big Data in simulation and reliability applications
• 3D Packaging and TSV Technology
• Heterogeneous Integration
• Chiplet Packaging
• Additive Manufacturing for Electronics

Abstract submission deadline: October 26, 2026

Notification of acceptance: December 17, 2026

Full paper submission deadline: March 2, 2027

More information:
https://www.eurosime.org/submissions/