EMSOFT: Embedded Software

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2024 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
EMSOFT 2023 International Conference on Embedded Software
Sep 17, 2023 - Sep 22, 2023 Hamburg, Germany Mar 23, 2023 (Mar 16, 2023)
EMSOFT 2022 International Conference on Embedded Software
Oct 7, 2022 - Oct 14, 2022 Hybrid-Shanghai Apr 7, 2022 (Mar 31, 2022)
EMSOFT 2021 International Conference on Embedded Software
Oct 10, 2021 - Oct 15, 2021 virtual Apr 9, 2021 (Apr 2, 2021)
EMSOFT 2019 International Conference on Embedded Software
Oct 13, 2019 - Oct 18, 2019 New York City, USA Apr 12, 2019 (Apr 5, 2019)
EMSOFT 2018 International Conference on Embedded Software
Sep 30, 2018 - Oct 5, 2018 Torino Incontra, Torino, Italy Apr 3, 2018 (Mar 27, 2018)
EMSOFT 2016 ACM SIGBED International Conference on Embedded Software
Oct 2, 2016 - Oct 7, 2016 Pittsburgh, PA Apr 8, 2016 (Apr 1, 2016)
EMSOFT 2014 The International Conference on Embedded Software
Aug 12, 2014 - Aug 17, 2014 New Delhi, India Apr 25, 2014 (Apr 18, 2014)
EMSOFT 2013 Embedded Software
Sep 29, 2013 - Oct 4, 2013 Montreal, Canada Apr 12, 2013 (Apr 5, 2013)
EMSOFT 2011 International Conference on Embedded Software
Oct 9, 2011 - Oct 14, 2011 Taipei, Taiwan Apr 4, 2011 (Mar 28, 2011)
EMSOFT 2009 International Conference on Embedded Software
Oct 12, 2009 - Oct 16, 2009 Grenoble, France May 8, 2009 (May 1, 2009)
 
 

Present CFP : 2023

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EMSOFT 2023
Call for Papers
International Conference on Embedded Software
September 17 – September 22, 2023, Hamburg, Germany
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The ACM SIGBED International Conference on Embedded Software (EMSOFT) brings together researchers and developers from academia, industry, and government to advance the science, engineering, and technology of embedded software development. Since 2001, EMSOFT has been the premier venue for cutting-edge research in the design and analysis of software that interacts with physical processes, with a long-standing tradition for results on cyber-physical systems, which compose computation, networking, and physical dynamics.

https://esweek.org/emsoft-call-for-papers-page/

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Timeline
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Journal-Track Submissions
- Abstracts: March 16, 2023 (AoE, Firm)
- Full Papers: March 23, 2023 (AoE, Firm)

Work-in-Progress Submissions
- May 22, 2023 (AoE, Firm)

Notification of Acceptance
- June 30, 2023 (both tracks)

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Topics of Interests / Tracks
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- Embedded distributed, networked systems
* Time-critical embedded systems
* Multi-/many-core processors, hardware accelerators
* Embedded operating systems and middleware
* Scheduling, resource allocation, and execution time analysis
* QoS management and performance analysis
* Hardware and software co-design
- Embedded software design and analysis
* Energy-efficient embedded software
* Safety/Mixed-critical embedded software
* Software design for cyber-physical systems
* Embedded software architectures for data-intensive applications and signal processing
- Resilience
* Embedded software security
* Robust implementation of control systems
- Process, methods
* Formal modeling and verification
* Testing, validation, and certification
* Model- and component-based approaches
- Empirical studies and their reproduction
- Sustainability, energy sobriety, low techs
- Application areas including automotive, avionics, energy, health care, mobile devices, multimedia, machine learning, and autonomous systems


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Journal-Integrated Publication Model
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EMSOFT 2023 solicits the submission of original research articles in two categories, i) full-length research papers that will be published in the the ACM Transactions on Embedded Computer Systems (TECS) and ii) short Work-in-Progress papers that will be published in the EMSOFT Proceedings. For both categories, EMSOFT solicits submission on all aspects of embedded software systems, including but not limited to the following topics. More information about the submission is at https://www.esweek.org/author-information.

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Organization
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EMSOFT Program Chairs:
Claire Pagetti, ONERA, FR
Alessandro Biondi, Scuola Superiore Sant'Anna, Italy

ESWEEK General Chairs:
Xiaobo Sharon Hu, General Co-Chair, University of Notre Dame, US
Alain Girault, INRIA, France

www.esweek.org
 

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