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Present CFP : 2023
CALL FOR PAPERS
23rd INTERNATIONAL CONFERENCE ON DISTRIBUTED APPLICATIONS AND INTEROPERABLE SYSTEMS (DAIS 2023)
AIM AND SCOPE
The DAIS conference series addresses all practical and conceptual aspects of
distributed applications, including their design, modelling, implementation
and operation, the supporting middleware, appropriate software engineering
methodologies and tools, as well as experimental studies and applications.
Submissions will be judged on their originality, significance, clarity,
relevance, and technical correctness.
The topics of interest to the conference include, but are not limited to:
Novel and innovative distributed applications and systems, particularly in the
cloud, edge and fog computing,
big data processing,
streaming and complex event processing,
distributed social networking,
IoT and cyber-physical systems,
advanced networking (SDN/NFV),
micro-services and service-oriented computing,
serverless and FaaS computing,
peer-to-peer systems, and
data center and internet-scale systems.
Novel architectures and mechanisms, particularly in the areas of
virtualisation and resource allocation,
trusted execution environments,
blockchains, cryptocurrencies and smart contracts, and
distributed consensus mechanisms.
System issues and design goals, including
interoperability and adaptation,
self-* properties (e.g., self-organisation, self-management,…),
security and practical applications of cryptography,
trust and privacy,
cooperation incentives and fairness,
fault-tolerance and dependability,
scalability and elasticity, and
tail-performance and energy-efficiency.
All papers must be original, unpublished, and not submitted for publication
elsewhere. DAIS 2023 offers three submission tracks:
* Full research papers in no more than 15 pages + 2 pages references.
* Full practical experience reports, including experimental and evaluation studies,
case studies, and practice reports in no more than 15 pages + 2 pages references.
* Work-in-Progress papers, describing ongoing work and interim results, in no more
than 6 pages + 2 pages references.
Papers should be submitted electronically as PDF, using the Springer LNCS style
to the conference submission website (https://easychair.org/my/conference?conf=dais2023).
Each paper will undergo a thorough process of peer reviews by the Program Committee.
Reviewing is single-blind: author name(s) should appear.
All papers accepted in any of the conference tracks will be included in the conference
proceedings, which will be published by Springer-Verlag in the LNCS series. Proceedings
will be made available at the conference. Submission implies that at least one author will
register and attend the conference if the paper is accepted.
To improve the reproducibility of results and to increase the visibility of prototypes and
tools produced by our community, authors of accepted papers (full papers, experience reports, WiP papers)
will be invited to submit publicly available artefacts associated with their paper for evaluation.
Based on the result of the evaluation, the paper may be awarded with badges. Artefact submission is optional
and the result of the artefact evaluation will not alter the paper’s acceptance decision. Detailed guidelines
for the preparation and submission of the artefacts will be made available to authors.
Abstract submission: February 11, 2023
Paper submission: February 18, 2023
Paper notification: March 31, 2023
Artefact submission: April 14, 2023
Artefact notification: April 30, 2023
Camera-ready: April 30, 2023 DAIS conference: June 19-23, 2023
* Marta Patiño-Martínez, Universidad Politécnica de Madrid, Spain
* João Paulo, INESC TEC & University of Minho, Portugal
* Ainhoa Azqueta, Universidad Politécnica de Madrid, Spain
* Claudio Mezzina, University Urbino, Italy
* Daniel O’Keeffe, Royal Holloway University of London, England
* Davide Frey, INRIA, France
* Emanuel Onica, Alexandru Ioan Cuza University of Iasi, Romania
* Evangelia Kalyvianaki, University of Cambridge, UK
* Etienne Riviére, Ecole Polytechnique de Louvain, Belgium
* Fábio Coelho, INESC TEC & U. Minho, Portugal
* Fábio Kon, University of São Paulo, Brazil
* Hans P. Reiser, Reykjavík University, Iceland
* Hein Meling, University of Stavanger, Norway
* João Leitão, Universidade Nova de Lisboa, Portugal
* Kostas Magoutis, University of Ioannina, Greece
* Miguel Matos, IST INESC-ID, Universidade de Lisboa, Portugal
* Pierre-Louis Aublin, Keio University, Japan
* Pierre Sutra, Telecom SudParis, France
* Romain Rouvoy, University of Lille, France
* Silvia Bonomi, Università degli Studi di Roma “La Sapienza”, Italy
* Spyros Voulgaris, Athens University of Economics and Business, Greece
* Valerio Schiavoni, University of Neuchâtel, Switzerland
* Vana Kalogeraki, Athens University of Economics and Business, Greece
* Vincenzo Gulisano, Chalmers University, Sweden
Artefact Evaluation Committee
* António Sousa, INESC TEC & U. Minho, Portugal
* Vinícius Cogo, Faculdade de Ciências, Universidade de Lisboa, Portugal