WISES: Workshop on Intelligent Solutions in Embedded Systems

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2018 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
WISES 2017 Workshop on Intelligent Solutions in Embedded Systems
Jun 12, 2017 - Jun 13, 2017 Hamburg, Germany Apr 25, 2017
WISES 2012 Workshop on Intelligent Solutions in Embedded Systems
Jul 5, 2012 - Jul 6, 2012 Klagenfurt, Austria Mar 1, 2012
WISES 2010 8th IEEE Workshop on Intelligent Solutions in Embedded Systems
Jul 8, 2010 - Jul 9, 2010 HERAKLION, CRETE, GREECE Mar 12, 2010
WISES 2009 Workshop on Intelligent Solutions in Embedded Systems
Jun 25, 2009 - Jun 26, 2009 Ancona, Italy Mar 16, 2009
WISES 2008 Sixth International Workshop on Intelligent Solutions in Embedded Systems
Jul 10, 2008 - Jul 11, 2008 Regensburg, Germany Mar 28, 2008
 
 

Present CFP : 2017

Embedded systems have an increasing importance in our everyday lives. The growing complexity of embedded systems and the emerging trend to interconnections between them lead to new challenges. Intelligent solutions are necessary to overcome these challenges and to provide reliable and secure systems to the customer under a strict time and financial budget.
WISES 2017 is a platform for presentation of innovative approaches that provide intelligent solutions in embedded systems. The objective of this workshop is to present mature approaches and to provide a forum for the exchange and discussion of ideas, and thus, the sharing of experiences among researchers, practitioners, and application developers both from industry and academia. Original papers addressing both theoretical and practical aspects of embedded systems are solicited. Papers describing prototype implementations and deployments of embedded systems are particularly welcome. In order to provide young researchers a forum to exchange their ideas WISES 2017 will include a special session for PhD-Students.
Topics of interest include, but are not limited to:
Embedded Systems Architecture ‐ Multicore SoC (e.g. homogeneous, heterogeneous MPSoC) ‐ Memory systems and optimization in embedded systems ‐ On‐chip buses and point‐to‐point networks ‐ Application‐specific (e.g. ASIPs, hardware accelerators)
Runtime Reconfigurable Computing – Architectures and tools – FPGAs for embedded applications
Software for single or multi‐core embedded systems ‐ Applications and systems software (e.g. drivers, communication libraries) ‐ Real‐time operating systems and middleware in embedded systems
Prototype platforms, applications and case studies ‐ Next generation networking and mobile/wireless technology ‐ Sensor networks and related hardware/software platforms ‐ Embedded systems with ambient intelligence and pervasiveness
Tools and methodologies for analysis, exploration and validation ‐ Cost‐efficient and power‐aware embedded system design ‐ Fault tolerance, reliability and security in embedded systems ‐ Real‐time embedded systems - Debugging and profiling techniques and tools
Emerging Technologies and Applications
Reconfigurable computing, Evolvable hardware, Energy harvesting and storage. ICT for health and ageing well, inclusion and governance, self-organizing embedded systems.
Automotive Applications
System‐level design of HW/SW in‐vehicle architectures, Tools to address the requirements for automotive electronic design, integration of different communication buses (like CAN, MOST, FlexRay and Ethernet), Security, Safety critical, driver assistance and comfort related applications, Electro-mobility, Battery management systems, Integration Electric Vehicle in smart energy grids.
Submission Guidelines

The working language of the conference is English. Prospective authors are invited to submit new original research papers of 4-8 pages (2 columns IEEE format). Submissions will only be accepted electronically easychair in PDF format All submitted papers will be peer-reviewed. Accepted papers will be published in printed proceedings with ISBN and in IEEE Xplore (pending quality check by IEEE). Selected papers will be invited to publish an improved version in a special issue of the EURASIP Journal on Embedded Systems (pending approval).
Venue

The conference will be held at Helmut Schmidt University of the Federal Armed Forces Hamburg, Germany.
Contact

For further information contact haase@hsu-hh.de or wilfried.elmenreich@aau.at
 

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