VLSI-SOC: Very Large Scale Integration of System-on-Chip

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2017 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
VLSI-SoC 2016 24th IFIP/IEEE International Conference on Very Large Scale Integration
Sep 26, 2016 - Sep 28, 2016 Tallinn, Estonia Apr 25, 2016 (Apr 18, 2016)
VLSI-SoC 2015 23rd IFIP/IEEE International Conference on Very Large Scale Integration
Oct 5, 2015 - Oct 7, 2015 Daejeon, Korea May 2, 2015 (Apr 25, 2015)
VLSI-SoC 2014 22nd IFIP/IEEE International Conference on Very Large Scale Integration
Oct 6, 2014 - Oct 8, 2014 Playa del Carmen, Mexico Apr 4, 2014
VLSI-SoC 2013 21st IFIP/IEEE International Conference on Very Large Scale Integration
Oct 7, 2013 - Oct 9, 2013 Istanbul, Turkey Apr 17, 2013
VLSI-SoC 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip
Oct 7, 2012 - Oct 10, 2012 Santa Cruz, USA Apr 30, 2012
VLSI-SoC 2010 18th IEEE/IFIP International Conference on VLSI and System-on-Chip
Sep 27, 2010 - Sep 29, 2010 Madrid, Spain Mar 28, 2010
 
 

Present CFP : 2016

VLSI-SoC 2016 is the 24th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5, IEEE CEDA and IEEE CASS, which explores the state-of-the-art in the areas that surround Very Large Scale Integration (VLSI) and System-on-Chip (SoC). Previous conferences have taken place in Edinburgh, Trondheim, Tokyo,
Vancouver, Munich, Grenoble, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florianópolis, Madrid, Hong Kong, Santa Cruz, Istanbul, Playa del Carmen, and Daejeon in South Korea. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase research as well industrial results in EDA, design
methodology, test, design, verification, devices, process, systems issues and application domains of VLSI and SoC.

Topics of interest include but are not limited to:
• Analog and mixed-signal IC design
• CAD: synthesis and analysis
• Circuits and systems for signal processing and communications
• Design for variability, reliability, and test
• Embedded system: architecture, design, and software
• Low-power and thermal-aware design
• Memory: technology, circuit, and system
• Prototyping, verification, modeling, and simulation
• System architectures: NoC, 3D, multi-core, and reconfigurable
 

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