TSP: Telecommunications and Signal Processing

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2023 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
TSP 2022 2022 45th International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS
Jul 13, 2022 - Jul 15, 2022 Virtual Conference May 10, 2022
TSP 2021 2021 44th International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS
Jul 26, 2021 - Jul 28, 2021 Virtual Conference May 15, 2021
TSP 2020 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS
Jul 7, 2020 - Jul 9, 2020 Milan Mar 15, 2020
TSP 2018 41st International Conference on Telecommunications and Signal Processing
Jul 4, 2018 - Jul 6, 2018 Athens, Greece Feb 15, 2018
TSP 2017 2017 40th International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS
Jul 5, 2017 - Jul 7, 2017 Barcelona, Spain Mar 14, 2017
TSP 2016 2016 39th International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS
Jun 27, 2016 - Jun 29, 2016 Vienna, Austria Mar 1, 2016
TSP 2015 2015 38th International Conference on Telecommunications and Signal Processing (TSP)
Jul 9, 2015 - Jul 11, 2015 Prague, Czech Republic Feb 28, 2015
TSP 2014 37th International Conference on Telecommunications and Signal Processing
Jul 1, 2014 - Jul 3, 2014 Berlin, Germany Feb 4, 2014
TSP 2012 35th International Conference on Telecommunications and Signal Processing
Jul 3, 2012 - Jul 4, 2012 Prague, Czech Republic Feb 12, 2012
 
 

Present CFP : 2022

2022 45th International Conference on Telecommunications and Signal Processing (TSP - IEEE Conference Record #55681)
July 13-15, 2022 (virtual conference)
Web: http://tsp.vutbr.cz/

• Deadline for Special Session and Workshop Proposals: May 10, 2022 (extended)
• Deadline for Full Paper Submissions: May 10, 2022 (extended)

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Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society.

Accepted papers will be submitted for inclusion into IEEE Xplore® Digital Library (IEEE Conference Record #55681) subject to meeting IEEE Xplore®’s scope and quality requirements. The indexed papers will be mirrored for indexing in SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, the authors of about 40% of the highest-rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process):

• Applied Sciences (ISSN 2076-3417), indexed by Web of Science (Impact Factor: 2.679)
• Remote Sensing (ISSN 2072-4292), indexed by Web of Science (Impact Factor: 4.848)
• Sensors (ISSN 1424-8220), indexed by Web of Science (Impact Factor: 3.576)
• International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals
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GENERAL INFORMATION:

You are kindly invited to participate in the 2022 45th International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/ - IEEE Conference Record #55681), which will be organized online during July 13-15, 2022. The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The conference aims to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.

TOPICS:

TSP 2022, driven by the theme 'eHealth Technologies', has opened Calls for Workshop and Special Session Proposals and Full Paper Submissions, with a deadline of May 10, 2022 (extended). We look forward to your innovative contributions in any of the following areas:

AREA 1: Telecommunications

1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement

AREA 2: Signal Processing

6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing

For more details, please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 .

WORKSHOPS AND SPECIAL SESSIONS::

Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2022 Conference. The following Workshops and Special Sessions were approved so far:

• WS1: 3rd International Workshop on Signal Processing Techniques for Ground Penetrating Radar Applications (SPT4GPRA), organized by Prof. Dr. Imad Al-Qadi, Prof. Dr. Amir M. Alani, Prof. Dr. Francesco Benedetto, Dr. Francesco Soldovieri, Prof. Dr. Fabio Tosti
• WS2: 6th International Workshop on Recent Advances in Biometrics and its Applications, organized by Prof. Dr. Larbi Boubchir and Prof. Dr. Boubaker Daachi
• SS1: Special Section on Advanced Multimedia Communications, organized by Dr. Laura-Maria Dogariu and Dr. Robert-Alexandru Dobre
• SS2: Special Section on Neurosignals Analysis, organized by Markos G. Tsipouras

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of the papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists of a Certificate of Appreciation.

ORGANIZERS:

The TSP 2022 is an IEEE technically co-sponsored conference organized in cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
• Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
• Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

COMMITTEES:

• Honorary Chair - Miloslav Filka, Brno University of Technology, Czech Republic – Full Professor, TSP Conference Founder
• General Chair - Norbert Herencsár, Brno University of Technology, Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member
• Publications & Student Paper Contest Chair - Jiří Hošek, Brno University of Technology, Czech Republic – IEEE Member
• Finance Chair - Nándor Mátrai, Asszisztencia Congress Bureau, Hungary – Managing Director
• Registration Chair - Csilla Fülöp, Asszisztencia Congress Bureau, Hungary – Project Manager

Steering Committee:

• Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor, IEEE Senior Member
• Larbi Boubchir, Université Paris 8, France – Associate Professor, IEEE Senior Member
• Marcos Faundez-Zanuy, Escola Universitària Politècnica de Mataró, Tecnocampus, Spain – Full Professor, Dean
​• İzzet Cem Göknar, Işık University, Turkey – Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow
• Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member
• Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
• Jaroslav Koton, Brno University of Technology, Czech Republic – Vice-dean for Research, IEEE Senior Member
• Sridhar Krishnan, Ryerson University, Canada – Full Professor & Associate Dean, IEEE Senior Member
• Mario Kušek, University of Zagreb, Croatia – IEEE Croatia Section Communications Chapter Chair, IEEE Member
• Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member
• Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior Member
• Jiří Mišurec, Brno University of Technology, Czech Republic – Full Professor, Department Chair
• Ram M. Narayanan, The Pennsylvania State University, USA – Full Professor, IEEE Fellow
• Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior Member
• Serdar Özoğuz, Istanbul Technical University, Turkey – Full Professor, Associate Chair
• Jakub Pęksiński, West Pomeranian University of Technology, Poland
• Hector Perez-Meana, National Polytechnic Institute, Mexico – Full Professor, IEEE Senior Member
• Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full Professor, Dean, IEEE Senior Member
• Costas Psychalinos, University of Patras, Greece – Full Professor, IEEE Senior Member
• Markus Rupp, Vienna University of Technology, Austria – Full Professor, Dean, IEEE Fellow
• Zdeněk Smékal, Brno University of Technology, Czech Republic – Full Professor, IEEE Senior Member
• Attila Vidács, Budapest University of Technology and Economics, Hungary – Deputy Head of Department
• Miroslav Vozňák, VŠB-Technical University of Ostrava, Czech Republic – Full Professor, Department Chair, IEEE Senior Member
• Drago Žagar, Josip Juraj Strossmayer University of Osijek, Croatia – Full Professor, Dean, IEEE Senior Member

IMPORTANT DATES:

• Deadline for Special Session and Workshop Proposals: May 10, 2022 (extended)
• Deadline for Full Paper Submissions: May 10, 2022 (extended)
• Notification of Paper Acceptance: June 10, 2022
• Final Paper Submission: June 24, 2022
• Authors' Registration and Payment: June 10 - July 1, 2022
• eCopyright Submission: July 1, 2022
• Authors' Video Presentation Upload: July 1, 2022
• Virtual Conference: July 13-15, 2022

CONTACTS:

Web: http://tsp.vutbr.cz/
E-mail: tsp@vut.cz

Follow us on:
• Facebook: https://www.facebook.com/tspconf/
• Twitter: https://twitter.com/tspconf/

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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the conference.
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