TEI: Tangible and Embedded Interaction



Past:   Proceedings on DBLP

Future:  Post a CFP for 2018 or later   |   Invite the Organizers Email


All CFPs on WikiCFP

Event When Where Deadline
TEI 2017 11th International Conference on Tangible, Embedded and Embodied Interactions
Mar 20, 2017 - Mar 23, 2017 Yokohama, Japan Aug 2, 2016
TEI 2016 Conference on Tangible Embedded and Embodied Interaction
Feb 14, 2016 - Feb 17, 2016 Eindhoven Aug 2, 2015
TEI 2015 9th International Conference on Tangible, Embedded and Embodied Interaction
Jan 15, 2015 - Jan 19, 2015 Stanford, USA Aug 1, 2014
TEI 2014 Eighth International Conference on Tangible, Embedded and Embodied Interaction
Feb 16, 2014 - Feb 19, 2014 Munich, Germany Aug 1, 2013
TEI 2013 Seventh International Conference on Tangible, Embedded and Embodied Interaction
Feb 10, 2013 - Feb 13, 2013 Barcelona, Spain Aug 6, 2012
Feb 19, 2012 - Feb 22, 2012 Kingston, ON Canada Sep 1, 2011
TEI 2011 Fifth International Conference on Tangible and Embedded Interaction - Explorations
Jan 22, 2011 - Jan 26, 2011 Funchal, Portugal Oct 17, 2010
TEI 2008 Tangible and Embedded Interaction
Feb 18, 2008 - Feb 21, 2008 Bonn, Germany Oct 5, 2007

Present CFP : 2017


The 11th TEI conference one year after the anniversary should set an outlook about the future directions of the community and the research. Therefore, we feel it is significant that the conference is hosted in Asia. Let’s create and experience the future together at TEI 2017. Related to past and future there is a fitting Japanese pro-verb: 温故知新 (On-ko-chi-shin). It means “you need to recall the past to understand the future” in English. We modified it slightly, as a tagline for our theme: ”recall your past to grasp the future”. More than most other academic venues in the interaction area, the TEI community understands that our mind is embodied, so to design the future we need to grasp it.

We will be actively searching for contributions and experiences that touch our future lifes, wellbeing productivity etc.


TEI 2017 is the 11th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. This year marks the first TEI conference held in Asia, It will be held in Japan from 20th to 23th March 2017. Fitting the Japanese pro-verb: 温故知新 (On-ko-chi-shin), “you need to recall the past to understand the future”, we invite the community to present novel work while reflecting on traditions in arts, design, and engineering.

The TEI conference has gained substantial visibility and activity over the past decade. It brings together researchers, practitioners, businesses, artists, designers and students from various disciplines, including engineering, interaction design, product design, computer science, and the arts. Application areas are diverse, including: human-augmentation, flexible and shape changing displays, haptic interaction, interactive surfaces, public art and performance; interactive robotics, games; learning; planning; automotive, fashion, furniture, and architectural design; music and sound creation; as well as productivity and creativity tools in domains ranging from scientific exploration to non-linear narrative.

The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, demonstrations, posters, art installations and performances, and participating in hands-on studio/workshops. We invite submissions from all of these perspectives: theoretical, conceptual, technical, applied, or artistic.

Accepted submissions of all types will be included in the ACM digital library proceedings.


Authors are invited to submit high-quality work detailing original research that contributes to advancing this rapidly developing field. Appropriate topics include but are not limited to:

• Novel interaction techniques that bridge the physical and digital worlds
• Theoretical foundations, frameworks, and concepts
• Flexible and shape changing displays
• Wearable technologies beyond the smartwatch
• Movement and choreography of interaction
• Meta-studies on tangible and embodied interactions
• Tools and toolkits for tangible and embodied interaction
• Novel application areas; industrial applications and implications
• Role of physicality in embodied sense-making (e.g., human perception, cognition and experience)
• Methodologies specific to tangible and embodied interaction design/research (including design guidelines, methods, approaches, lessons learned)
• Case studies and evaluations of working deployments
• Tangible interaction for artistic and/or expressive systems
• Philosophical, ethical and social implications
• Key challenges and opportunities; proposals for research agendas and dissemination


Papers should be between 4 pages and 8 pages long (not including references) in the two-column ACM SIGCHI format. They must be in PDF file format. All papers will undergo the same review process and be published in the same way. Length must match the contribution, and the same general criteria hold for all papers. Regardless of length, a paper may be presented as a talk, demo and/or poster. When submitting your paper, we want to emphasize that providing a supplementary two-minute video (if appropriate) will not only facilitate the review process, but also increase the visibility of the work, during and after the conference. *** We will allocate significant exposure to (two-minute) videos throughout the conference ***

All work must be submitted electronically via the TEI Precision Conference site. During submission, authors may propose the presentation format that they feel best suits their contribution, which may include multiple presentation forms. The available formats include:

• Talk
• Demo
• Poster
Please do consider the most appropriate presentation format for your work. TEI is particularly strong in demonstrations and installations and encourages both by publishing their descriptions and videos in the full conference proceedings.


Submissions will be reviewed in a double-blind process, and authors must ensure that their names and affiliations do not appear on the submitted papers. The author and affiliation sections of the ACM SIGCHI template must be left blank. In case of acceptance, authors will be asked to provide a camera-ready copy that includes this information, along with any recommended improvements as suggested by the reviewers.

Furthermore, all references should remain intact. If you previously published a paper and your current submission builds on that work, the reference – with authors – should appear in the references. Submission should not have blank references (e.g., “12. REMOVED FOR REVIEWING”). We encourage authors to refer to their previous work in the third person. Further suppression of identity in the body of the paper, while encouraged, is left to the authors' discretion.


Confidentiality of submissions will be maintained during the review process. All rejected submissions will be kept confidential in perpetuity. All submitted materials for accepted submissions will be kept confidential until the start of the conference.


Please note that the maximum size of your submission should not exceed 40 Mb. If your requirements exceed this limit, please contact the program chairs below to make alternative arrangements. It will be possible to submit large videos via a link to online content (e.g. youtube or vimeo).


One author of each accepted submission must register for the conference before the early registration deadline in order for the final paper version to be published in the conference proceedings. Papers will be published in the ACM digital library.


If you have further questions about Papers for TEI 2017, contact the Program Chairs Kai Kunze, Orit Shaer, and Jürgen Steimle.


All papers must be submitted electronically via the TEI Precision Conference site.

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