SPM: Solid and Physical Modeling

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2023 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
SPM 2022 Solid and Physical Modeling
Jun 27, 2022 - Jun 29, 2022 Singapore (online) Feb 17, 2022 (Feb 11, 2022)
SPM 2020 Solid and Physical Modeling
Jun 2, 2020 - Jun 4, 2020 Strasbourg, France Jan 20, 2020 (Jan 15, 2020)
SPM 2019 Solid and Physical Modeling
Jun 17, 2019 - Jun 19, 2019 Vancouver, Canada Feb 8, 2019 (Jan 28, 2019)
SPM 2016 Symposium on Solid & Physical Modeling 2016
Jun 20, 2016 - Jun 24, 2016 Berlin, Gemany Feb 7, 2016 (Jan 31, 2016)
SPM 2014 Symposium on Solid and Physical Modeling
Oct 26, 2014 - Oct 28, 2014 Hong Kong, China Apr 8, 2014 (Mar 30, 2014)
SPM 2012 Symposium on Solid and Physical Modeling
Oct 29, 2012 - Oct 31, 2012 Dijon, France Apr 2, 2012 (Mar 25, 2012)
SPM 2010 Symposium on Solid and Physical Modeling
Sep 1, 2010 - Sep 3, 2010 Haifa, Israel Feb 22, 2010 (Feb 1, 2010)
SPM 2008 ACM Solid and Physical Modeling Symposium
Jun 2, 2008 - Jun 4, 2008 Stony Brook, NY, USA Nov 27, 2007
 
 

Present CFP : 2022

The Symposium on Solid and Physical Modeling (SPM) is an international conference series organised annually with the support of the Solid Modeling Association (SMA). The conference aims at all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas. The conference serves also as a ceremony for awarding the 2022 Pierre B├ęzier Prize for contributions to solid, shape, and physical modeling. Due to global pandemic, SPM 2022 will be held as an online event. https://spm2022.sciencesconf.org/

Topics of interest include, but are not limited to:

- 3D fabrication/printing/manufacturing technologies
- Anisotropic/heterogeneous/composite materials
- Applied algebraic and differential geometry
- Applied computational geometry and topology
- Conceptual, collaborative, and distributed design
- Computational fabrication
- Curve, surface, and manifold modeling
- Dimensioning and tolerancing
- Feature modeling, recognition, and understanding
- Geometric algorithms
- Geometric and topological representations
- Geometric constraint solving and parametric modeling
- Geometric interpolation and smoothing
- Geometry generation and processing
- Geometry compression and transmission
- Isogeometric analysis
- Meshing and mesh optimization
- Multi-resolution modeling
- Numerical analysis of geometric algorithms
- Physically-based modeling and simulation
- Product data exchange, standards, and interoperability
- Reverse engineering/reconstruction of surfaces/solids
- Robustness and validity of geometric computations
- Shape modeling, synthesis and analysis

Paper Submissions: Accepted full-length papers will be published in the journal of Computer-Aided Design (Elsevier) after a rigorous two-stage double-blind review process. Papers should be formatted according to the style guidelines for Computer-Aided Design and should not exceed 12 pages, including figures and references. We strongly recommend using the LaTeX template to format your paper, but we also accept papers formatted by MS Word according to the style guidelines for Computer-Aided Design (Elsevier). The file must be submitted in PDF format using the EasyChair website https://easychair.org/conferences/?conf=spm20220. For any queries regarding paper submission, please contact the paper chairs at spmChairs2022@easychair.org

Important Dates:

- Abstract for full papers: February 11, 2022
- Full paper submission: February 17, 2022
- First review notification: March 25, 2022
- Revised papers due: April 15, 2022
- Final notification: April 29, 2022
- Camera ready papers: May 16, 2022
- Conference: June 27-29, 2022

Conference chairs

- Konrad Polthier, Freie Universit├Ąt Berlin, Germany
- Myung-Soo Kim, Seoul National University, Korea
- Ying He, Nanyang Technological University, Singapore

Program chairs

- Georges-Pierre Bonneau, University of Grenoble, France
- Morad Behandish, Palo Alto Research Center, USA
- Jianmin Zheng, Nanyang Technological University, Singapore
 

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