SLE: Software Language Engineering

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2016 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
SLE 2015 ACM SIGPLAN Software Language Engineering
Oct 25, 2015 - Oct 27, 2015 Pittsburgh, USA Jun 15, 2015 (Jun 1, 2015)
SLE 2013 International Conference on Software Language Engineering
Oct 26, 2013 - Oct 28, 2013 Indianapolis, IN, USA Jun 14, 2013 (Jun 7, 2013)
SLE 2012 5th International Conference on Software Language Engineering
Sep 25, 2012 - Sep 28, 2012 Dresden, Germany Jun 11, 2012 (Jun 4, 2012)
SLE 2011 International Conference on Software Language Engineering
Jul 3, 2011 - Jul 6, 2011 Braga, Portugal Apr 15, 2011
SLE 2010 International Conference on Software Language Engineering
Oct 12, 2010 - Oct 13, 2010 Eindhoven, The Netherlands Jul 5, 2010 (Jun 28, 2010)
SLE 2009 2nd International Conference on Software Language Engineering
Oct 5, 2009 - Oct 6, 2009 Denver, Colorado, USA Jul 10, 2009 (Jul 3, 2009)
SLE 2008 1st International Conference on Software Language Engineering
Sep 29, 2008 - Sep 30, 2008 Toulouse, France Jul 14, 2008
 
 

Present CFP : 2015

ACM SIGPLAN 8th International Conference on Software Language Engineering (SLE) 2015

Pittsburg, USA, October 2015

http://www.sleconf.org/2015/

Co-located with:
ACM SIGPLAN conference on Systems, Programming, Languages and Applications: Software for Humanity (SPLASH 2015)
14th International Conference on Generative Programming: Concepts and Experiences (GPCE 2015)


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IMPORTANT DATES

Deadline for abstracts: 1 June 2015
Deadline for papers: 15 June 2015
Author notification: 24 July 2015
Camera ready copies due: 7 August 2015
SLE workshops: 25 October 2015
Conference: 25-27 October 2015

All dates are Anywhere on Earth.

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SCOPE

Software Language Engineering (SLE) is the application of systematic, disciplined, and measurable approaches to the development, use, deployment, and maintenance of software languages. The term "software language" is used broadly, and includes: general-purpose programming languages; domain-specific languages (e.g. BPMN, Simulink, Modelica); modeling and metamodeling languages (e.g. SysML and UML); data models and ontologies (e.g. XML-based and OWL-based languages and vocabularies).

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TOPICS OF INTEREST

SLE aims to be broad-minded and inclusive about relevance and scope. We solicit high-quality contributions in areas ranging from theoretical and conceptual contributions to tools, techniques, and frameworks. Topics of interest include, but are not limited to, the following:

- Approaches and methodologies for language design
- Tools for language design and implementation (incl. meta-languages, meta-tools, language workbenches)
- Generative approaches (incl. transformation and transformation languages, code generation)
- Interpreters and interpreter composition
- Techniques for analysing (and proving properties of) software language descriptions
- Techniques for software language reuse, evolution and management of variations (syntactic/semantic) within language families
- Integration and coordination of disparate software languages and tools
- Applications of DSLs for different purposes (incl. modeling, simulating, generation, description, checking)
- Novel applications and/or empirical studies on any aspect of SLE (development, use, deployment, and maintenance of software languages)
- Cross-fertilization of different technological spaces (e.g. modelware, grammarware, ontologies)

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TYPES OF SUBMISSIONS

- Research papers: These should report a substantial research contribution to SLE or successful application of SLE techniques or both. Full paper submissions must not exceed 12 pages (in ACM SIGPLAN conference style).
- Tool papers: Because of SLE's ample interest in tools, we seek papers that present software tools related to the field of SLE. Selection criteria include originality of the tool, its innovative aspects, and relevance to SLE. Tool papers should include an appendix outlining the proposed demonstration, including screenshots etc. A short video may be linked as well. Tool paper submissions must not exceed 6 pages (in ACM SIGPLAN conference style).
- Bridging position papers: These papers discuss bridging ideas from the different areas of SLE (e.g. modelling, programming languages, grammars, etc). This includes both foundational ideas and/or practical techniques. Bridging position papers must not exceed 2 pages (in ACM SIGPLAN conference style).

In 2015, industrial experience papers should be submitted to the ITSLE workshop.

Papers should follow the ACM SIGPLAN conference style, 10 point font: http://www.sigplan.org/Resources/Author/

Note that by default the SIGPLAN Proceedings Format produces papers in 9 point font by default. If you are formatting your paper using LaTeX, you will need to set the 10pt option in the \documentclass command. If you are formatting your paper using Word, you may wish to use the provided Word template that supports this font size. Please include page numbers in your submission; setting the preprint option in the LaTeX \documentclass command generates page numbers. Please also ensure that your submission is legible when printed on a black and white printer. In particular, please check that colors remain distinct and font sizes are legible.

Submitted articles must not have been previously published or currently be submitted for publication elsewhere. The program chairs will apply the principles of the ACM Plagiarism Policy throughout the submission and review process.

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PUBLICATIONS

All submitted papers will be reviewed by at least three members of the program committee. Authors will be given a brief opportunity for a reply to the reviews. The replies will be considered in the PC's discussions, and considered in the selection of the best reviewer. All accepted papers will be published in ACM Digital Library.

Authors of best papers from the conference will be invited to revise and submit extended versions of their papers for a Journal special issue.

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AWARDS

- Best paper. Award for best overall paper, as determined by the PC chairs based on the recommendations of the programme committee.
- Best presentation. Award for the best paper presentation. We want to encourage well structured and lively presentations. Determined by the audience.
- Best reviewer. Award for best reviewer, as determined by the PC chairs using feedback from the authors.

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CONTACT

For any questions or concerns about the call for paper, please contact the program co-chairs at: pcchairs@sleconf.org

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GENERAL CHAIR

Richard Paige, University of York, UK


PROGRAM COMMITTEE CO-CHAIRS

Davide Di Ruscio, University of L'Aquila, Italy
Markus Voelter, Independent researcher, consultant and coach for itemis AG, Germany

PUBLICITY CHAIR

Anya Helene Bagge, University of Bergen, Norway

PROGRAM COMMITTEE (TO BE COMPLETED)

Emilie Balland, INRIA Bordeaux - Sud-Ouest, France
Anya Helene Bagge, University of Bergen, Norway
Marco Brambilla, Politechnic Milan, Italy
Jordi Cabot, INRIA research group at Ecole des Mines de Nantes, France
Benoit Combemale, University of Rennes 1, France
Zinovy Diskin, McMaster University / University of Waterloo, Canada
Jean-Marie Favre, University of Grenoble, France
Holger Giese, Hasso Plattner Institute at the University of Potsdam, Germany
Martin Gogolla, University of Bremen, Germany
Thomas Goldschmidt, ABB Corporate Research, Germany
Jeff Gray, University of Alabama, USA
Angelo Hulshout, Independent Consultant, The Netherlands
Zhenjiang Hu, National Institute of Informatics, Japan
Adrian Johnstone, Royal Holloway, UK
Dimitris Kolovos, University of York, UK
Juan de Lara, Universidad Autonoma de Madrid, Spain
Terence Parr, University of San Francisco, US
David J. Pearce, Victoria University of Wellington, New Zealand
Alfonso Pierantonio, University of L'Aquila, Italy
Daniel Ratiu, Siemens Corporate Technology, Germany
Tijs van der Storm, CWI, The Netherlands
Eugene Syriani, University of Montreal, Canada
Juha-Pekka Tolvanen, MetaCase, Finland
Guido Wachsmuth, Delft University, The Netherlands
Manuel Wimmer, Tu Wien, Austria
Daniel Varro, Budapest University of Technology and Economics, Hungary
Vadim Zaytsev, Universiteit van Amsterdam, Amsterdam, The Netherlands





 

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