ATS: Asian Test Symposium

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2014 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
ATS 2013 Asian Test Symposium
Nov 18, 2013 - Nov 22, 2013 Yilan, Taiwan May 24, 2013
ATS 2011 20th Asian Test Symposium
Nov 21, 2011 - Nov 23, 2011 New Delhi, India May 27, 2011
ATS 2010 19th Asian Test Symposium
Dec 1, 2010 - Dec 4, 2010 Shanghai, China TBD
 
 

Present CFP : 2013

The Asian Test Symposium (ATS) provides an open forum for researchers and
industrial practitioners from all countries of the world, especially from Asia, to
exchange innovative ideas on system, board, and device testing with design,
manufacturing and field consideration in mind.
Original papers on, but not limited to, the following areas are invited.
• Automatic Test Pattern Generation
• Fault Modeling and Simulation
• Design Verification and Validation
• Diagnosis and Debug
• Board and System Test
• Analog/Mixed-Signal Test
• High-Speed I/O Test
• RF Test
• Delay and Performance Test
• Memory Test/FPGA Test
• System-in-Package/3D Test
• Software Testing
• Boundary Scan Test
• Built-In Self-Test
• Design-for-Testability
• Test Compression
• On-Line Test
• Temperature/Power-Aware Testing
• Defect-Based Testing
• Fault Tolerance
• Dependable System
• Yield Analysis and Enhancement
• Test Quality
• Economics of Test
Submissions
Regular Sessions: The ATS'13 Program Committee invites original, unpublished
paper submissions on the above topics. Paper submissions should be complete
manuscripts, not exceeding six pages (including figures, tables, and bibliography)
in a standard IEEE two-column format. The submission will be considered
evidence that upon acceptance the author(s) will submit a final camera-ready
version of the paper for inclusion in the proceedings, and will present the paper at
the symposium. The registration of at least one author is required for publication.
Special Sessions, Tutorials: Suggestions and proposals are welcome. Contact the
Program Chair for more information.
 

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