ATS: Asian Test Symposium

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2018 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
ATS 2017 Asian Test Symposium
Nov 27, 2017 - Nov 30, 2017 Taipei, Taiwan May 26, 2017
ATS 2013 Asian Test Symposium
Nov 18, 2013 - Nov 22, 2013 Yilan, Taiwan May 24, 2013
ATS 2011 20th Asian Test Symposium
Nov 21, 2011 - Nov 23, 2011 New Delhi, India May 27, 2011
ATS 2010 19th Asian Test Symposium
Dec 1, 2010 - Dec 4, 2010 Shanghai, China TBD
 
 

Present CFP : 2017

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The 26th IEEE Asian Test Symposium (ATS’17)
Palais de Chine Hotel, Taipei, Taiwan
Nov. 27-30, 2017
http://ares.ee.ncu.edu.tw/ats17/index.php
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Overview:
The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world, especially from Asia, to exchange innovative ideas on system, board, and device testing with design, manufacturing and field consideration in mind.


Scope:
• Analog/Mixed-Signal Test
• Automatic Test Generation
• Board Test and Diagnosis
• Boundary Scan Test
• Built-In Self-Test (BIST)
• Defect-Based Test
• Delay and Performance Test
• Dependability and Functional Safety
• Design for Test (DFT)
• Diagnosis and Silicon Debug
• Economic of Test
• Failure Analysis
• Fault Modeling and Simulation
• Fault Tolerance
• GPU Test
• High-Speed I/O Test
• Low-Power IC Test
• Memory Test and Repair
• MEMS Test
• Multi-/Many-core Processor Test
• Nanotechnology Test
• On-line Test
• Power/Thermal/Reliability Issues in Test
• Reconfigurable System Test
• Reliability
• RF Test
• Hardware-oriented Security and Trust
• Self-Repair
• Sensor Test
• SiP, Stacked, 3D IC Test
• SoC Test
• Standards in Test
• Statistical Learning in Test
• Test Compression
• Test Quality
• Test Synthesis
• Validation and Verification
• Yield Analysis and Enhancement


Regular Sessions:
The ATS'17 Program Committee invites orignal, unpublished paper submissions on the above topics. Paper submissions should be complete manuscripts, not exceeding six pages (including figures, tables, and bibliography) in a standard IEEE two-column format. The submission will be considered evidence that upon acceptance the author(s) will submit a final camera-ready version of the paper for inclusion in the proceedings, and will present the paper at the symposium. The registration of at least one author is required for publication.


Key Dates:
Submission deadline: May 26, 2017
Notification of acceptance: July 31, 2017
Camera ready manuscript: August 31, 2017
 

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