ASP-DAC: Asia and South Pacific Design Automation Conference

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2019 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
ASP-DAC 2018 23rd Asia and South Pacific Design Automation Conference
Jan 22, 2018 - Jan 25, 2018 Jeju Island , Korea Jul 7, 2017
ASP-DAC 2016 Asia and South Pacific Design Automation Conference
Jan 25, 2016 - Jan 28, 2016 Macao, China Jul 8, 2015
ASP-DAC 2015 Asia and South Pacific Design Automation Conference
Jan 19, 2015 - Jan 22, 2015 Makuhari, Japan Jul 11, 2014
ASP-DAC 2014 Asia and South Pacific Design Automation Conference
Jan 20, 2014 - Jan 23, 2014 SunTec´╝îSingapore Jul 10, 2013
ASP-DAC 2012 17th Asia and South Pacific Design Automation Conference
Jan 30, 2012 - Feb 2, 2012 Sydney, Australia Jul 19, 2011
ASP-DAC 2011 16th Asia and South Pacific Design Automation Conference
Jan 25, 2011 - Jan 28, 2011 Yokohama, Japan Jul 19, 2010
ASP-DAC 2010 Asia and South Pacific Design Automation Conference
Jan 18, 2010 - Jan 21, 2010 Taipei, Taiwan Aug 3, 2009
ASP-DAC 2009 14th Asia and South Pacific Design Automation Conference
Jan 19, 2009 - Jan 22, 2009 Yokohama, Japan Jul 14, 2008
ASP-DAC 2008 Asia and South Pacific Design Automation Conference
Jan 21, 2008 - Jan 24, 2008 Seoul, South, Korea Nov 16, 2007
 
 

Present CFP : 2018

ASP-DAC 2018 is the 23rd annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most
active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific
CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies
related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive
interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who
are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.
Areas of Interest:
Original papers in, but not limited to, the following areas are invited.
[1] System-Level Modeling and Design Methodology:
1.1. HW/SW co-design, co-simulation and co-verification
1.2. System-level design exploration, synthesis and optimization
1.3. Model- and component-based embedded system/software design
1.4. System-level formal verification
1.5. System-level modeling, simulation and validation
tools/methodology
[2] Embedded System Architecture and Design:
2.1. Many- and multi-core SoC architecture
2.2. Reconfigurable and self-adaptive SoC architecture
2.3. IP/platform-based SoC design
2.4. Domain-specific architecture
2.5. Dependable architecture
2.6. On-chip memory architecture
2.7. Cyber physical system
2.8. Storage system architecture
2.9. Internet of things
[3] On-chip Communication and Networks-on-Chip:
3.1. On-chip communication network
3.2. Networks-on-chip
3.3. Interface and I/O design
3.4. Optical and RF on-chip communication
[4] Embedded Software:
4.1. Kernel, middleware and virtual machine
4.2. Compiler and toolchain
4.3. Real-time system
4.4. Resource allocation for heterogeneous computing platform
4.5. Storage software and application
4.6. Human-computer interface
4.7. System verification and analysis
[5] Device/Circuit-Level Modeling, Simulation and Verification:
5.1. Device/circuit/interconnect modeling and analysis
5.2. Device/circuit-level simulation tool and methodology
5.3. RTL and gate-leveling modeling, simulation and verification
5.4. Circuit-level formal verification
[6] Analog, RF and Mixed Signal:
6.1. Analog/mixed-signal/RF synthesis
6.2. Analog layout, verification and simulation techniques
6.3. Noise analysis
6.4. High-frequency electromagnetic simulation of circuit
6.5. Mixed-signal design consideration
6.6. Power-aware analog circuit/system design
6.7. Analog/mixed-signal modeling and simulation techniques
6.8. CAD for memory circuits
[7] Power Analysis, Low Power Design, and Thermal Management:
7.1. Power modeling, analysis and simulation
7.2. Low-power design and methodology
7.3. Thermal aware design
7.4. Architectural low-power design technique
7.5. Energy harvesting and battery management
[8] Logic/High-Level Synthesis and Optimization:
8.1. High-level synthesis tool and methodology
8.2. Combinational, sequential and asynchronous logic synthesis
8.3. Logic synthesis and physical design technique for FPGA
8.4. Technology mapping
[9] Physical Design:
9.1. Floorplanning, partitioning and placement
9.2. Interconnect planning and synthesis
9.3. Placement and routing optimization
9.4. Clock network synthesis
9.5. Post layout and post-silicon optimization
9.6. Package/PCB/3D-IC routing
[10] Design for Manufacturability and Reliability:
10.1. Reticle enhancement, lithography-related design and optimization
10.2. Resilience under manufacturing variation
10.3. Design for manufacturability, yield, and defect tolerance
10.4. Reliability, aging and soft error analysis
10.5. Design for reliability, aging, and robustness
[11] Timing and Signal/Power Integrity:
11.1. Deterministic/statistical timing and performance analysis and
optimization
11.2. Power/ground and package modeling, analysis and optimization
11.3. Signal/power integrity, EM modeling and analysis
11.4. Extraction, TSV and package modeling
11.5. 2D/3D on-chip power delivery network analysis and optimization
[12] Test and Design for Testability:
12.1. ATPG, BIST and DFT
12.2. Fault modeling and simulation
12.3. System test and 3D IC test
12.4. Online test and fault tolerance
12.5. Memory test and repair
12.6. Analog and mixed-signal/RF test
[13] Security and Fault-Tolerant System:
13.1. Security modeling and analysis
13.2. Architecture, tool and methodology for secure hardware
13.3. Design for security and security primitive
13.4. Cross-layer security
13.5. Fault analysis, detect and tolerance
[14] Emerging Technology:
14.1. New transistor/device and process technology: spintronic,
phase-change, single-electron etc.
14.2. CAD for nanotechnology, MEMS, 3D IC, quantum computing etc.
[15] Emerging Application:
15.1. Biomedical application
15.2. Big data application
15.3. Advanced multimedia application
15.4. Energy-storage/smart-grid/smart-building design and optimization
15.5. Datacenter optimization
15.6. Automotive system design and optimization
15.7. Electromobility
 

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