ICCAD: International Conference on Computer Aided Design

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Past:   Proceedings on DBLP

Future:  Post a CFP for 2020 or later   |   Invite the Organizers Email

 
 

All CFPs on WikiCFP

Event When Where Deadline
ICCAD 2019 International Conference On Computer Aided Design
Nov 4, 2019 - Nov 7, 2019 Westminster, CO Apr 8, 2019 (Apr 1, 2019)
ICCAD 2018 International Conference on Computer Aided Design
Nov 5, 2018 - Nov 8, 2018 San Diego Apr 23, 2018 (Apr 16, 2018)
ICCAD 2017 International Conference on Computer Aided Design
Nov 13, 2017 - Nov 17, 2017 Irvine, CA Apr 24, 2017 (Apr 17, 2017)
ICCAD 2016 International Conference on Computer Aided Design
Nov 7, 2016 - Nov 10, 2016 Austin, TX Apr 25, 2016 (Apr 18, 2016)
ICCAD 2015 International Conference on Computer Aided Design
Nov 2, 2015 - Nov 6, 2015 Austin, TX Apr 24, 2015 (Apr 17, 2015)
ICCAD 2014 International Conference on Computer Aided Design
Nov 3, 2014 - Nov 6, 2014 San Jose Apr 14, 2014 (Apr 7, 2014)
ICCAD 2013 The International Conference on Computer-Aided Design
Oct 28, 2013 - Oct 31, 2013 San Jose, CA, USA Apr 8, 2013 (Apr 1, 2013)
ICCAD 2012 IEEE/ACM International Conference on Computer-Aided Design
Nov 5, 2012 - Nov 9, 2012 San Jose, USA Apr 16, 2012
ICCAD 2011 The International Conference on Computer-Aided Design
Nov 6, 2011 - Nov 10, 2011 San Jose, CA Apr 18, 2011
ICCAD 2010 The International Conference on Computer-Aided Design
Nov 7, 2010 - Nov 7, 2010 San Jose, CA, USA Apr 19, 2010
ICCAD 2008 The International Conference on Computer-Aided Design
Nov 10, 2008 - Nov 10, 2008 San, Jose, CA, USA Apr 14, 2008
ICCAD 2007 The International Conference on Computer-Aided Design 2007
Nov 4, 2007 - Nov 8, 2007 San, Jose, CA, USA TBD
 
 

Present CFP : 2019

1) SYSTEM-LEVEL CAD
1.1 System Design:
System-level specification, modeling, and simulation
System design flows and methods
HW/SW co-design, co-simulation, co-optimization, and co-exploration
HW/SW platforms for rapid prototyping
System design case studies and applications
System-level issues for 3D integration
Micro-architectural transformation
Memory architecture and system synthesis
System communication architecture
Network-on-chip design methodologies and CAD
Modeling and simulation of heterogeneous platforms
High-level synthesis for heterogeneous computing
Power/performance analysis of heterogeneous and cloud platforms
Programming environment of heterogeneous computing
Application driven heterogeneous platforms for big data, machine learning etc.
Applications and designs for systems based on optical devices
1.2 Embedded Systems and Cyberphysical Systems
Multi-core/multi-processors systems
HW/SW co-design for embedded systems
Static and dynamic reconfigurable architectures
Memory hierarchies and management
System-level consideration of custom memory/storage architectures
Application-specific instruction-set processors (ASIPs)
CAD for Internet-of-Things (IoT) and sensor networks
Design issues for Internet-of-Things (IoT) Devices
Modeling and analysis of CPS
CAD for automotive systems and power electronics
Dependable and safe CPS design
Analysis and optimization of data centers
CAD for display electronics
Green computing (smart grid, energy, solar panels, etc.)
1.3 Neural Network and Neuromorphic Computing
Hardware and devices for neuromorphic and neural network computing
Design method for learning on a chip
Systems for neural computing (including deep neural networks)
Neural network acceleration techniques including GPGPU, FPGA and dedicated
ASICs
CAD for bio-inspired and neuromorphic systems
1.4 Embedded Systems Software and Software Security
Real-time software and operating systems
Middleware and virtual machines, runtime support and resource management
Timing analysis and WCET
Profiling and compilation techniques, domain-specific embedded libraries
Design exploration, synthesis, validation, verification, and optimization
Software techniques and programming models for multicores, GPUs, and
multithreaded embedded architectures
System and embedded software security techniques
Malware and Cloud security
Security and privacy for the Internet of Things
Embedded software forensics

1.5 Hardware Security
Hardware-based security (CAD for PUF’s, RNG, AES etc)
Detection and prevention of hardware Trojans
Side-channel attacks, fault attacks and countermeasures
Split Manufacturing for security
Design and CAD for security
Security implications of CAD
Cyberphysical system security
Nanoelectronic security
Supply chain security and anti-counterfeiting
1.6 Low Power and Approximate Computing in System Design
Power and thermal estimation, analysis, optimization, and management
techniques for hardware and software systems
Energy- and thermal aware application mapping and scheduling
Energy- and thermal-aware dark silicon system design and optimization
Energy- and thermal-aware architectures, algorithms and techniques
Run-time management for the dark silicon
New hardware techniques for approximate/stochastic computing

2) SYNTHESIS, VERIFICATION, AND PHYSICAL DESIGN
2.1 High-Level, Behavioral, and Logic Synthesis and Optimization:
High-level/Behavioral/Logic synthesis
Technology-independent optimization and technology mapping
Functional and logic timing ECO
Resource scheduling, allocation, and synthesis
Interaction between logic synthesis and physical design
2.2 Testing, Validation, Simulation, and Verification:
High-level/Behavioral/Logic modeling and validation
High-level/Behavioral/Logic simulation
Formal, semi-formal, and assertion-based verification
Equivalence and property checking
Emulation and hardware simulation/acceleration
Post-silicon functional validation
Digital fault modeling and simulation
Delay, current-based, low-power test
ATPG, BIST, DFT, and compression
Memory test and repair
Core, board, system, and 3D IC test
Post-silicon validation and debug
Analog, mixed-signal, and RF test
2.3 Cell-Library Design, Partitioning, Floorplanning, Placement:
Cell-library design and optimization
Transistor and gate sizing
High-level physical design and synthesis
Estimation and hierarchy management
2D and 3D partitioning, floorplanning, and placement
Post-placement optimization
Buffer insertion and interconnect planning
2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification:
2D and 3D clock network synthesis
2D and 3D global and detailed routing
Package-/Board-level routing and chip-package-board co-design
Post-layout/-silicon optimization
Layout and routing issues for optical interconnects

3) SOC ANALYSIS, DESIGN, SIMULATION, AND TESTING
3.1Design for Manufacturability and Design for Reliability
Process technology characterization, extraction, and modeling
CAD for design/manufacturing interfaces
CAD for reticle enhancement and lithography-related design
Variability analysis and statistical design and optimization
Yield estimation and design for yield
Physical verification and design rule checking
DFM for emerging devices (3D, nanophotonics, non-volatile logic/memory, etc.)
Machine learning for smart manufacturing and process control
Analysis and optimization for device-level reliability issues (stress, aging effects,
ESD, etc.)
Analysis optimization for interconnect reliability issues (electromigration, thermal,
etc.)
Reliability issues related to soft errors
Design for resilience and robustness
Reliability issues for emerging devices (3D, optical, non-volatile, etc.)
3.2 Timing, Power and Signal Integrity Analysis and Optimization
Deterministic and statistical static timing analysis and optimization
Power and leakage analysis and optimization
Circuit and interconnect-level low power design issues
Power/ground network analysis and synthesis
Signal integrity analysis and optimization
3.3 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling
CAD for analog, mixed-signal, RF
CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electrooptical) devices, circuits, and systems
CAD for nanophotonics and optical devices
Analog, mixed-signal, and RF noise modeling and simulation
Device, interconnect and circuit extraction and simulation
Package modeling and analysis
EM simulation and optimization
Behavior modeling of devices and interconnect
Modeling of complex dynamical systems (molecular dynamics, fluid dynamics,
computational finance, etc.)
4) CAD FOR EMERGING TECHNOLOGIES, PARADIGMS, AND APPLICATIONS
4.1 Biological Systems and Electronics, Brain Inspired Computing, and New Computing
Paradigms:
CAD for biological computing systems
CAD for systems and synthetic biology
CAD for bio-electronic devices, bio-sensors, MEMS, and systems
4.2 Nanoscale and Post-CMOS Systems:
New device structures and process technologies
New memory technologies (flash, phase change memory, STT-RAM, memristor,
etc.)
Nanotechnologies, nanowires, nanotubes, graphene, etc.
Quantum computing
Optical devices, computing, and communication

SUBMISSION DETAILS
Paper submissions must be made through the online submission system at the ICCAD
web site: https://www.softconf.com/i/iccad2019
Regular papers will be reviewed as finished papers; preliminary submissions will be at a
disadvantage.
Authors are asked to submit their work in two stages. In stage one (abstract
submission), a title, abstract, and a list of all co-authors must be submitted via the
ICCAD web submission site. In stage two (paper submission), the paper itself is
submitted. Authors are responsible for ensuring that their paper submission meets all
guidelines, and that the PDF is readable.
Deadline for Abstract Submissions
The submission abstract deadline is 5:00 pm Pacific Daylight Time (GMT -07:00),
Monday, April 1, 2019. No abstract submissions will be possible after this deadline.
Deadline for Paper Submissions The submission paper deadline is 5:00 pm Pacific
Daylight Time (GMT -07:00), Monday April 8, 2019.
We always have several authors contact the ICCAD office asking for a deadline
extension. Due to the limited review cycle, NO extensions are granted for ANY reason.
REGULAR PAPER SUBMISSIONS
• All papers must be in PDF format only, with savable text.
• Each paper must be no more than 8 pages (including the abstract, figures,
tables, and references), double-columned, 9pt or 10pt font.
• Your submission must not include information that serves to identify the authors
of the manuscript, such as name(s) or affiliation(s) of the author(s), anywhere in the
manuscript, abstract, or in the embedded PDF data. References and bibliographic
citations to the author(s) own published works or affiliations should be made in the third
person.
• Submissions not adhering to these rules, or determined to be previously
published (this includes pre-prints publicly available on personal or other websites, such
as arXiv, or publicly available internal memoranda with author names divulged) or
simultaneously submitted to another conference, or journal, will be summarily rejected.
Internal memoranda with full content not publicly available, and with author names not
divulged, may be submitted.
IMPORTANT: Final camera-ready versions must be identical to the submitted papers
with the following exceptions; inclusion of author names/affiliation, correction of
identified errors, addressing reviewer-demanded changes. No other modifications of
any kind are allowed including modification of title, change of the author list,
reformatting, restyling, rephrasing, removing figures/results/text, etc. The TPC Chairs
reserve the right to finally reject any manuscripts not adhering to these rules. A report
detailing all the revisions made must be submitted together with the final camera-ready
manuscript once any revision is conducted.
TEMPLATES
Paper templates are available at the ICCAD website; authors are recommended to
format their papers based on the templates. NOTIFICATION OF ACCEPTANCE
Authors will be notified of acceptance on or before Friday, June 21, 2019. Final paper
guidelines will be sent at that time.
PROCEEDINGS
The deadline for final papers is Friday, July 26, 2019. Accepted papers are allowed six
pages in the conference proceedings free of charge. Each additional page beyond six
pages is subject to the page charge at $150.00 per page up to the eight-page limit.
IEEE will hold the copyright for ICCAD 2019 proceedings. Authors of accepted papers
must sign an IEEE copyright release form for their paper.
CONFERENCE REGISTRATION
At least one author per accepted paper must register by Friday, July 26, 2019, at the
discounted speaker’s registration rate. Failure to register will result in your paper being
removed from the conference proceedings. IEEE reserves the right to exclude a paper
from distribution after the conference (e.g., removal from IEEE Xplore) if the paper is not
presented at the conference.
ACM/IEEE WILLIAM J. MCCALLA ICCAD BEST PAPER AWARD
Two papers, one from front-end and one from back-end, will be awarded with this
prestigious award. The winners will be chosen from nominated papers after a thorough
and competitive process by area-specific selection committees and announced at the
opening session.
ICCAD TEN-YEAR RETROSPECTIVE MOST INFLUENTIAL PAPER AWARD
One paper from 2009 and 2010 editions of ICCAD will be selected for this outstanding
recognition as evidenced by impact on the research community reflected in citations, on
the vendor community via its use in an industrial setting, or by initiating new research
venues during the past decade. Nominations from the community are welcome and can
be sent to to Rolf Drechsler, Technical Program Vice-Chair at drechsler@unibremen.de.

PROPOSALS
Call for Workshop, Tutorial, Special Session, Panel and Keynote Proposals, all due
Thursday, April 11, 2019
WORKSHOP PROPOSALS
ICCAD provides a vibrant and supportive environment for small-to-medium-sized
affiliated workshops. Typical workshops are one-day events on the Thursday of ICCAD,
with ICCAD providing all logistical support (registration, lunch, room bookings, hotel,
pre-conference financials, etc.) All workshop proposals should be sent to, Workshop
Chair Evangeline Young, at fyyoung@cse.cuhk.edu.hk
TUTORIAL PROPOSALS
All ICCAD tutorials are embedded in the main technical program and free to conference
attendees, providing value to attendees and a good audience for presenters. Typical
tutorials run 1.5-2 hours, although longer tutorials (consisting of two session blocks of
1.5-2 hours each) may be considered. Tutorial suggestions should not exceed two
pages, should describe the topic and intended audience, and must include a list of
suggested participants with biographical data. Proposals should focus on the state-ofthe-art in a specific area of broad interest amongst ICCAD attendees. All tutorial
proposals should be sent to Tulika Mitra, Tutorial and Special Sessions Chair, at
tulika@comp.nus.edu.sg.
SPECIAL SESSION PROPOSALS
Special Sessions typically run 1.5-2 hours. Special session proposals should focus on
in-depth treatment on a topic of timely interest to the ICCAD audience. Special session
proposals should not exceed two pages, should describe the topic and intended
audience, and must include a list of suggested participants with biographical data. All
special session proposals should be sent to Tulika Mitra, Tutorial and Special Sessions
Chair, at tulika@comp.nus.edu.sg.
PANEL PROPOSALS
Panel suggestions should not exceed two pages, should describe the topic and
intended audience, and should include a list of suggested participants. Panel
suggestions must include a bulleted outline of covered topics. All panel proposals
should be sent to Yuan Xie, Technical Program Chair at yuanxie@ucsb.edu.
KEYNOTE PROPOSALS
Keynote proposals should include descriptions of suggested keynote speakers, and the
importance of the speech to the ICCAD audience. All keynote proposals should be sent
to David Pan, General Chair, at dpan@ece.utexas.edu.
ICCAD reserves the right to restructure all panel, special session, and tutorial
proposals.
 

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